OWC 16GB DDR4 3200MHz CL22 1.2V 260pin SODIMM Alienware X17 R1
- 16GB
- 260-Pin DDR4 Non-EC…
AMD
32-core server processor running at 2.6 GHz with 128 MB L3 cache, 64 threads and DDR4-3200 support across eight memory channels
The AMD EPYC 7513 is a 32-core, 64-thread server processor built for the SP3 socket. It runs at a 2.6 GHz base frequency with a 3.65 GHz maximum turbo speed and includes 128 MB of L3 cache. The chip supports eight-channel DDR4 3200 memory and provides 128 lanes of PCI Express 4.0 connectivity within a 200 W thermal design power envelope.
This processor fits deployments that need high core counts and large memory bandwidth on existing DDR4 infrastructure. It is not suited for workloads that demand higher single-thread frequencies or systems that require a different socket type. Buyers without SP3-compatible motherboards or adequate cooling for a 200 W TDP should look at other options.
The 128 MB L3 cache delivers high hit rates for latency-sensitive applications, while 128 lanes of PCI Express 4.0 allow extensive I/O expansion without bottlenecks. These two specifications together determine whether the processor matches the memory and connectivity needs of the target server configuration.
| Brand | AMD |
|---|---|
| Series | AMD EPYC 7003 |
| Name | EPYC 7513 |
| Model | 100-100000334WOF |
| CPU Socket Type | Socket SP3 |
| Core Name | Milan |
| # of Cores | 32-Core |
| # of Threads | 64 |
| Operating Frequency | 2.6 GHz |
| Max Turbo Frequency | 3.65 GHz |
| L3 Cache | 128MB |
| 64-Bit Support | Yes |
| Manufacturing Tech | 7 nm |
| Integrated Memory Controller Speed | DDR4 3200 |
| Memory Channel | 8 Channel |
| Virtualization Technology Support | Yes |
| PCI Express Revision | 4.0 |
| Max # of PCI Express Lanes | 128 |
| Thermal Design Power | 200W |
| Cooling Device | Cooling device not included - Processor Only |
| 배송 무게 | 0.82 kg |
| 포장 크기 | 152 × 152 × 102 mm |
The processor has a thermal design power of 200 W, which sets the cooling capacity needed for continuous operation.
The 200 W TDP indicates the sustained power draw and heat output that a cooling solution must handle during extended workloads.
The motherboard must provide an SP3 socket and eight-channel DDR4 memory support for the processor to operate.
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