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ASUS TUF GAMING Z890-PLUS WIFI ATX motherboard in dark grey and yellow with large VRM heatsinks, four DDR5 slots and multiple M.2

ASUS

ASUS TUF GAMING Z890-PLUS WIFI Intel motherboard

SKU CH-BVKF-23HAP MPN TUF GAMING Z890-PLUS WIFI

ATX board for Intel Core Ultra Series 2 with 16+1+2+1 80A power stages, DDR5 up to 9066 MT/s, PCIe 5.0 M.2, Thunderbolt 4, Wi-Fi 7 and 2.5Gb LAN

  • CPU Socket TypeLGA 1851
  • CPU TypeIntel Core Ultra Processors (Series 2)
  • ChipsetIntel Z890
  • Number of Memory Slots4x288pin (DDR5)
  • Memory StandardDDR5 4400 / DDR5 4800 / DDR5 5000 / DDR5 5200 / DDR5 5400 /
  • Maximum Memory Supported256GB

Option TUF GAMING Z890-PLUS WIFI

취소선으로 표시된 버전은 존재하지만, 이곳에서는 취급하지 않습니다.

  • Ready for Intel Core Ultra Series 2 processors via LGA 1851 socket
  • Stable power delivery from 16+1+2+1 80A DrMOS stages with ProCool connectors
  • High-speed storage with one PCIe 5.0 M.2 and three PCIe 4.0 M.2 slots
  • Fast wired and wireless networking through 2.5Gb Ethernet and Wi-Fi 7
  • Thunderbolt 4 and front USB 20Gbps Type-C for versatile connectivity

Intel Core Ultra Series 2 motherboard

The ASUS TUF GAMING Z890-PLUS WIFI is built for Intel Core Ultra Processors (Series 2) on the LGA 1851 socket. It targets builders who want a Z890 chipset foundation for high-performance desktops and advanced AI workloads. Four DDR5 slots support up to 256 GB of memory in a dual-channel configuration.

Thermals and power delivery

A 16+1+2+1 DrMOS power stage design rated at 80 A per stage feeds the CPU through ProCool connectors on an 8-layer PCB. Large VRM heatsinks, dedicated M.2 and PCH heatsinks, and hybrid fan headers managed by Fan Xpert 4 with AI Cooling II handle heat under sustained loads. The board draws power from standard ATX and EPS connectors without exotic requirements.

DDR5 memory support up to 9066 MT/s

The memory subsystem validates speeds from 4400 up to 9066 MT/s (OC) via Intel XMP 3.0 and ASUS Enhanced Memory Profile III. This wide frequency range lets you match kits to workload demands, whether you prioritise low latency or maximum throughput for AI and gaming.

주요 특징

  • Ready for Intel Core Ultra Series 2 processors via LGA 1851 socket
  • Stable power delivery from 16+1+2+1 80A DrMOS stages with ProCool connectors
  • High-speed storage with one PCIe 5.0 M.2 and three PCIe 4.0 M.2 slots
  • Fast wired and wireless networking through 2.5Gb Ethernet and Wi-Fi 7
  • Thunderbolt 4 and front USB 20Gbps Type-C for versatile connectivity

사양

BrandASUS
ModelTUF GAMING Z890-PLUS WIFI
CPU Socket TypeLGA 1851
CPU TypeIntel Core Ultra Processors (Series 2)
ChipsetIntel Z890
Number of Memory Slots4x288pin (DDR5)
Memory StandardDDR5 4400 / DDR5 4800 / DDR5 5000 / DDR5 5200 / DDR5 5400 / DDR5 5600 / DDR5 5800 / DDR5 6000 / DDR5 6200 / DDR5 6400 / DDR5 6600 / DDR5 6800 / DDR5 7000 / DDR5 7200 / DDR5 7400 / DDR5 7600 / DDR5 7800 / DDR5 7900 / DDR5 7950 / DDR5 8000 / DDR5 8200 / DDR5 8266 / DDR5 8400 / DDR5 8600 / DDR5 8666 / DDR5 8800 / DDR5 8933 / DDR5 9000 / DDR5 9066
Maximum Memory Supported256GB
Channel SupportedDual Channel
Memory Performance ProfileIntel XMP 3.0
Memory FeatureSupport up to 9066+MT/s (OC), Non-ECC, Un-buffered ,Clocked Unbuffered DIMM (CUDIMM)*
Dual channel memory architecture
DIMM Fit
Supports Intel Extreme Memory Profile (XMP) memory module
ASUS Enhanced Memory Profile III(AEMPIII)
** Non-ECC, un-buffered DDR5 memory supports On-Die ECC function.
PCI Express 5.0 x161 x PCI Express 5.0 x16
PCI Express 4.0 x161 x PCI Express 4.0 x16
Serial ATA (SATA)4 x SATA 6Gb/s
M.21 x M.2 (Support PCIe 5.0 x4) / 3 x M.2 (Support PCIe 4.0 x4)
Audio Channels7.1 Channels
Max LAN Speed2.5Gbps
Wireless LANWi-Fi 802.11 be
Back I/O Ports1 x DisplayPort / 1 x Flash BIOS Button / 1 x HDMI / 1 x Optical S/PDIF Out / 1 x Thunderbolt 4 / 1 x USB 3.1 Gen 2 Type-C / 5 x Audio Jacks / 6 x USB 3.1 Gen 2 Type-A
Windows 11Supported
Form FactorATX
배송 무게2.04 kg
포장 크기356 × 267 × 64 mm

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같은 제품군에서 메모리·쿨러·클럭이 다릅니다 — 결정 전에 비교해 보세요.

이 상품에 대한 질문

How do I install the CPU into the LGA 1851 socket without bending pins?

Lift the retention lever, align the processor triangle with the socket marker, lower the CPU gently without pressure, then close and latch the lever; the common error is pressing down before the lever is fully locked.

Which components on this board will need replacement first during long-term use?

The VRM heatsinks and M.2 thermal pads handle sustained heat; inspect pads annually and replace if they harden, while the CMOS battery typically lasts several years before a swap is needed.

What limit appears first when the 16+1+2+1 80A power stages run under continuous heavy load?

VRM temperature rises until the AI Cooling II curve ramps the hybrid fan headers; if airflow is restricted, thermal throttling on the CPU voltage regulators becomes the bottleneck.

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