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Axiom

Axiom A8547953-AX 8 GB DDR4-2133 SODIMM server RAM

SKU CH-20XH-GXHDX MPN A8547953-AX

8 GB DDR4 SODIMM running at 2133 MHz with CL15 latency and 1.20 V operation

  • 8 GB capacity boosts multitasking headroom
  • 2133 MHz DDR4 speed handles demanding workloads
  • CL15 latency keeps response times low
  • 20 V operation reduces power draw
  • 260-pin SODIMM fits compatible notebook slots

Axiom 8 GB DDR4-2133 SODIMM

This 8 GB DDR4 SODIMM runs at 2133 MHz with CL15 latency and a 1.20 V operating voltage. It uses a 260-pin layout that fits compatible Dell notebook slots. The module is designed to handle everyday workloads without excessive power draw.

260-pin DDR4 form factor

The 260-pin DDR4 interface ensures the module seats correctly in supported Dell notebooks. This physical and electrical match allows the memory to operate at its rated 2133 MHz speed and CL15 timing. No extra software or drivers are required for the hardware to function.

DDR4-2133 speed ceiling

The DDR4-2133 standard caps the data rate at 2133 MT/s, so the module cannot run faster even if the platform supports higher speeds. CL15 latency is fixed for this part and does not scale with tighter timings. Systems limited to lower bus speeds will downclock the module automatically.

주요 특징

  • 8 GB capacity boosts multitasking headroom
  • 2133 MHz DDR4 speed handles demanding workloads
  • CL15 latency keeps response times low
  • 20 V operation reduces power draw
  • 260-pin SODIMM fits compatible notebook slots

사양

이 상품에 대해 아직 공개된 사양이 없습니다.

이 상품에 대한 질문

Will the CL15 latency require any future adjustment or replacement?

The CL15 timing is fixed by the module's SPD and does not drift; no maintenance or replacement is needed for latency.

What limit appears first during sustained heavy workloads?

The 2133 MHz bus speed and 8 GB capacity set the throughput ceiling before thermal or power limits are reached.

How much heat and power does the 1.20 V SODIMM produce when running all day?

At 1.20 V the DDR4 module draws minimal power and the low-profile design dissipates heat without active cooling.

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