Bean
Bean Thermal Pad 12.8 W/mK 85x45x2mm 15g
Thermal pad with 12.8 W/mK conductivity, 85x45x2mm size, 15g weight, non-conductive, operates from -40°C to 200°C
- Volume / Net Weight15g
- Thermal Conductivity12.8 W/mK,
- Long Term Operating Temperature-40 C to +400C
- SpecificationsThermal Conductivity:12.8W/M-K Density:3.3±0.1 Hardness:40-8
- FeaturesCost-effective, low thermal resistance High conformability,
- High thermal conductivity of 12.8 W/mK moves heat fast
- Non-conductive insulation prevents shorts on sensitive components
- Soft 40-80 Shore C pad conforms to uneven surfaces
- Withstands -40 °C to 200 °C without melting or degrading
- 85 x 45 x 2 mm sheet cuts easily for custom fit
Thermal pad 12.8 W/mK for component gaps
This thermal pad delivers 12.8 W/mK conductivity to bridge uneven surfaces between chips and heatsinks. It suits builders servicing laptops, graphics cards, LED arrays or control boards where paste cannot fill larger gaps. The 85 x 45 x 2 mm sheet can be trimmed to fit various component footprints.
Operating range -40 °C to 200 °C and insulation
The pad remains stable from -40 °C up to 200 °C continuous use without melting or degrading. It is non-conductive with a breakdown voltage above 6 kV/mm, so contact with exposed traces will not cause shorts. Density is 3.3 ± 0.1 and hardness spans 40 to 80 Shore C for consistent compression.
Single 15 g sheet replaces paste in many roles
One 15 g pad replaces traditional grease for CPU, GPU, power LED, motor driver or set-top box cooling. The material is naturally tacky, wear-resistant, fire-retardant and anti-static, so it stays in place through thermal cycles. It can be cut to size for prototype work or volume assembly.
주요 특징
- High thermal conductivity of 12.8 W/mK moves heat fast
- Non-conductive insulation prevents shorts on sensitive components
- Soft 40-80 Shore C pad conforms to uneven surfaces
- Withstands -40 °C to 200 °C without melting or degrading
- 85 x 45 x 2 mm sheet cuts easily for custom fit
사양
| Brand | Thermalright |
|---|---|
| Series | Thermal Pad |
| Model | 85x45x2mm |
| Volume / Net Weight | 15g |
| Thermal Conductivity | 12.8 W/mK, |
| Long Term Operating Temperature | -40 C to +400C |
| Specifications | Thermal Conductivity:12.8W/M-K Density:3.3±0.1 Hardness:40-80(Sc) Breakdown Voltage:>6KV/Mm Temperature Range:-40°C~200°C |
| Features | Cost-effective, low thermal resistance High conformability, soft and flexible One Pad , multi-purpose, durable,insulated, non-conductive lnsulation does not conduct electricity and is safe for use Natural viscosity, easy to assemble and reusable |
이 상품에 대한 질문
How do I install the 85x45x2mm thermal pad and what step do people often miss?
Cut the pad to size, remove both protective films, place it between the component and heatsink, then apply even pressure when mounting. The step many miss is peeling off the second film before assembly.
What maintenance or replacement will the 12.8 W/mK pad need later?
The silicone pad is designed for long-term use from -40°C to 200°C without drying out. Replace it only if the heatsink is removed or the pad shows physical damage or compression set.
What limit appears first when the pad runs under sustained load?
The pad remains stable up to 200°C continuous operating temperature. If the component exceeds that temperature, the material will degrade before any other property fails.
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