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Computer Memory Solutions

Computer Memory Solutions 16GB (2x8GB) DDR3L 1600 SODIMM 1.35V EliteBook 8770W

SKU CH-ZBY2-H8JEA

16 GB dual-channel DDR3L 1600 SODIMM kit at 1.35 V, CL11, validated for the EliteBook 8770W mobile workstation

  • Capacity16GB (2 x 8GB)
  • Type204-Pin DDR3 SO-DIMM
  • SpeedDDR3L 1600 (PC3L 12800)
  • CAS LatencyCL11
  • Timing11-11-11
  • Voltage1.35V
  • 16 GB kit upgrades EliteBook 8770W to maximum capacity
  • DDR3L 1600 MHz speed matches factory specification
  • 35 V low voltage reduces power draw
  • CL11 11-11-11 timings deliver responsive performance
  • 204-pin SODIMM form factor fits both expansion slots

16GB DDR3L kit for EliteBook 8770W

This 16GB kit comprises two 8GB DDR3L SODIMM modules rated at 1600MHz with CL11 timings. It is built specifically for the HP EliteBook 8770W mobile workstation. The unbuffered, non-ECC design matches the notebook's memory architecture. Voltage is set at 1.35V for DDR3L operation.

Dual-module kit enables dual-channel bandwidth

The package supplies two matched sticks so the workstation can run in dual-channel mode. This doubles the memory throughput compared with a single module. No heat spreaders are included, keeping the low-profile SODIMM form factor. The kit is guaranteed compatible by the manufacturer for the listed system.

16GB fills half the 32GB maximum

The EliteBook 8770W supports up to 32GB across four sockets. This 16GB kit occupies two slots, leaving two free for future expansion. It handles typical mobile workstation workloads such as CAD, rendering and virtualisation. Buyers who need the full 32GB capacity will require additional modules.

주요 특징

  • 16 GB kit upgrades EliteBook 8770W to maximum capacity
  • DDR3L 1600 MHz speed matches factory specification
  • 35 V low voltage reduces power draw
  • CL11 11-11-11 timings deliver responsive performance
  • 204-pin SODIMM form factor fits both expansion slots

사양

BrandComputer Memory Solutions
ModelCM10246412800SODRL
Capacity16GB (2 x 8GB)
Type204-Pin DDR3 SO-DIMM
SpeedDDR3L 1600 (PC3L 12800)
CAS LatencyCL11
Timing11-11-11
Voltage1.35V
ECCNo
Buffered/RegisteredUnbuffered
Rank2Rx8
ChipsetMajor Brand Chipset
Heat SpreaderNo
Compatible SystemHp/Compaq Elitebook 8770W Mobile Workstation
Package Content2 Memory RAM Sticks

이 상품에 대한 질문

Will the 2Rx8 DDR3L SODIMMs need any firmware updates or thermal-pad replacements over their service life?

No firmware or thermal-pad maintenance is required; the unbuffered modules run at 1.35 V with a limited lifetime warranty from the manufacturer.

What capacity ceiling will I hit first when filling the EliteBook 8770W workstation?

The platform accepts up to 32 GB across four sockets, so this 16 GB kit leaves two slots free for future expansion.

How much heat and power do the CL11 1600 MHz sticks generate during all-day workloads?

Operating at 1.35 V without a heat spreader, the DDR3L modules produce minimal heat and draw low power under continuous use.

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