BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
Corsair
16 GB dual-channel DDR4 kit rated at 3600 MT/s with CL18 timings and a low-profile aluminum heatspreader
This 16GB dual-channel kit contains two 8GB modules rated at 3600 MT/s with CL18 timings. It targets builders assembling AMD Ryzen platforms who want a straightforward memory upgrade without manual tuning. The 1.35V operating voltage matches standard DDR4 specifications for stable operation.
Each module uses a low-profile anodized aluminum heatspreader that dissipates heat while clearing larger CPU coolers. The custom performance PCB further assists thermal management. An Intel XMP 2.0 profile stores the 3600 MT/s speed and 18-22-22-42 timings, enabling one-click configuration in compatible BIOS.
The CAS latency of 18 cycles at the rated 3600 MT/s data rate is the primary figure that determines responsiveness in latency-sensitive workloads. Buyers who need tighter timings at this frequency should consider alternative kits. The 288-pin form factor fits standard DDR4 desktop slots only.
| Brand | CORSAIR |
|---|---|
| Series | Vengeance LPX |
| Model | CMK16GX4M2Z3600C18 |
| Capacity | 16GB (2 x 8GB) |
| Type | 288-Pin PC RAM |
| Speed | DDR4 3600 (PC4 28800) |
| CAS Latency | CL18 |
| Timing | 18-22-22-42 |
| Voltage | 1.35V |
| BIOS/Performance Profile | Intel XMP 2.0 |
| Color | Black |
| Heat Spreader | Anodized Aluminum |
| Features | Designed for high-performance overclocking Each VENGEANCE LPX module is built with a pure aluminum heatspreader for faster heat dissipation and cooler operation; and the custom performance PCB helps manage heat and provides superior overclocking headroom. Each IC is individually screened for performance potential. Designed for great looks Available in multiple colors to match your motherboard, your components, or just your style. Performance and Compatibility VENGEANCE LPX is optimized and compatibility tested for the latest Intel DDR4 motherboards and offers higher frequencies, grea |
| Recommend Use | AMD 300 Series / AMD 400 Series / AMD Ryzen Compatible / AMD TRX40 / AMD X470 / AMD X570 |
| 배송 무게 | 0.10 kg |
| 포장 크기 | 178 × 89 × 13 mm |
The aluminum heatspreader is passive and has no moving parts; a light dusting with compressed air every few months is all that is required to maintain airflow over the fins.
The modules are rated for continuous operation at 1.35 V with the XMP 2.0 profile; thermal throttling is the first boundary, so case airflow must keep the heatspreader temperature within safe limits.
The memory itself is silent and adds only the heat from its 1.35 V operation; any audible noise comes from case fans that must move enough air to cool the aluminum heatspreaders.
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