DELL
DELL PowerEdge R540 2U rack server 2× Xeon Gold 6130 2.1GHz 16C 128GB DDR4 8× 4TB SAS
A 2U rack server with dual 16-core Xeon Gold 6130 CPUs, 128GB DDR4 ECC memory, eight 4TB 7.2K SAS drives on a PERC H330 controller, dual 750W platinum PSUs, iDRAC9 Enterprise, and rails included
- TypeRack
- Rack Height2U
- Redundant Hot-swap PowerYes
- CPU TypeIntel Xeon
- CPU Speed2.10 GHz
- CPU SocketLGA 3647
- Dual 16-core Xeon Gold 6130 CPUs at 2.1 GHz base with 3.7 GHz turbo
- 128GB DDR4 2666MHz ECC memory across eight DIMM slots for virtualization headroom
- PERC H330 controller supports RAID 0, 1, 5, 10, 50 and pass-through
- Eight 4TB 7.2K SAS drives in 3.5-inch bays for high-capacity storage
- iDRAC 9 Enterprise plus dual 750W Platinum PSUs for remote management and power redundancy
Ready-to-deploy 2U rack server
The Dell PowerEdge R540 arrives as a complete 2U rack server with dual Intel Xeon Gold 6130 processors, 128GB of DDR4 ECC memory and eight 4TB SAS hard drives. It targets IT teams that need a pre-configured platform for virtualization, database hosting or file serving without assembling components themselves. Buyers who want a different drive count, GPU acceleration or a tower form factor should look elsewhere.
Dual 750 W platinum supplies and intelligent cooling
Two hot-swap 750 W 80+ Platinum power supplies provide redundancy while the chassis cooling system manages heat from the 16-core CPUs and 7.2K drives. Fan speeds adjust to workload so acoustic output stays appropriate for a data-centre aisle rather than an office desk. No liquid-cooling provision or external radiator support exists on this chassis.
Enterprise chassis with rails and iDRAC9
The 2U enclosure includes sliding rails and a front bezel for standard rack mounting. A PERC H330 controller handles RAID 0, 1, 5, 10 and 50 across the eight 3.5-inch bays. Dual 1 GbE RJ45 ports and iDRAC9 Enterprise give remote KVM, power control and hardware inventory over a dedicated management network.
주요 특징
- Dual 16-core Xeon Gold 6130 CPUs at 2.1 GHz base with 3.7 GHz turbo
- 128GB DDR4 2666MHz ECC memory across eight DIMM slots for virtualization headroom
- PERC H330 controller supports RAID 0, 1, 5, 10, 50 and pass-through
- Eight 4TB 7.2K SAS drives in 3.5-inch bays for high-capacity storage
- iDRAC 9 Enterprise plus dual 750W Platinum PSUs for remote management and power redundancy
사양
| Brand | DELL |
|---|---|
| Series | PowerEdge |
| Model | R540 |
| Type | Rack |
| Rack Height | 2U |
| Redundant Hot-swap Power | Yes |
| CPU Type | Intel Xeon |
| CPU Speed | 2.10 GHz |
| CPU Socket | LGA 3647 |
| Number of CPU Cores | 16-Core Processor |
| CPU Features | Gold 6130 |
| # of Processors Installed | 2 |
| MAX Processors | 2 |
| Installed Memory Size | 128GB |
| Memory Type | DDR4 |
| Max Memory Capacity | 1TB |
| Number of Memory Slots | 16 |
| Hard Drive (Installed) | 8 x 4TB 7.2K SAS |
| Storage Controller | Dell Perc H330 Controller |
| HDD Interface | SAS |
| SSD (Installed) | No |
| Raid Level | RAID 0/1/5/10/50 |
| Ethernet Controller | 1x Dell EMC Integrated Dual Port Network Daughter Card - 2x 1 Gigabit RJ45 Ports, |
| Remote Management | Dell EMC 14G PowerEdge iDRAC 9 Enterprise License |
| LAN Ports | 2 x Ports |
| Management Port | RJ 45 |
| Operating System | No |
이 상품에 대한 질문
How do I install the 128GB DDR4 2666MHz registered ECC memory into the 16 DIMM slots on this R540?
Populate the 8x 16GB modules in the white release tabs first, following the CPU1 then CPU2 channel sequence printed on the air shroud; the common mistake is skipping a channel and leaving performance on the table.
Which component will need replacement first when the 8x 4TB 7.2K SAS drives reach their rated workload limit?
The 7.2K SAS hard drives themselves are the first wear item; plan to swap individual 4TB units as SMART alerts appear, using the hot-swap carriers while the H330 rebuilds the RAID set.
What thermal limit appears first when both Xeon Gold 6130 CPUs sustain 3.7GHz turbo under full load?
The dual 750W Platinum supplies and redundant fan wall keep the 2U chassis within spec, so the CPU package temperature hits its 80°C throttle point before any power or airflow ceiling is reached.
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