BFKK
BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
US$214.99
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G.SKILL
G.SKILL F4-3200C16D-32GTZ TridentZ 32GB (2 x 16GB) DDR4 3200 CL16 desktop RAM
Dual-channel 32 GB DDR4 kit running at 3200 MT/s with CL16 timings and a 1.35 V aluminium heat spreader
- Capacity32GB (2 x 16GB)
- SpeedDDR4 3200 (PC4 25600)
- CAS LatencyCL16
- Timing16-18-18-38
- Voltage1.35V
- ECCNo
- 32 GB dual-channel kit for high-capacity multitasking
- DDR4 3200 speed with CL16 latency for responsive performance
- 35 V operation reduces power draw and heat
- Intel XMP 2.0 profile enables rated speed in BIOS
- Aluminum heat spreader in gray and red keeps modules cool
Dual-channel kit for Intel Z-series
This 32 GB kit contains two matched 16 GB DDR4 modules rated at 3200 MT/s with CL16 timings. The aluminium heat spreader in grey and red covers each module. Intel XMP 2.0 profiles allow the rated speed and 16-18-18-38 timings at 1.35 V when enabled in the BIOS.
Builders using listed Intel or AMD platforms
The kit is validated for Intel Z270, Z370, Z390, Z490, Z590, Z690 DDR4 and Z790 DDR4 chipsets, plus AMD X470, X570 and B550 platforms. It is not suited for systems that require ECC or registered memory, nor for laptops or small-form-factor boards that only accept SO-DIMM modules.
Rated speed and latency
The decisive specification is the DDR4 3200 CL16 rating with XMP 2.0 support. If your motherboard and CPU combination cannot reach 3200 MT/s or does not support XMP, the modules will fall back to standard JEDEC speeds and the rated timings will not be achieved.
주요 특징
- 32 GB dual-channel kit for high-capacity multitasking
- DDR4 3200 speed with CL16 latency for responsive performance
- 35 V operation reduces power draw and heat
- Intel XMP 2.0 profile enables rated speed in BIOS
- Aluminum heat spreader in gray and red keeps modules cool
사양
| Brand | G.SKILL |
|---|---|
| Series | TridentZ Series |
| Model | F4-3200C16D-32GTZ |
| Capacity | 32GB (2 x 16GB) |
| Speed | DDR4 3200 (PC4 25600) |
| CAS Latency | CL16 |
| Timing | 16-18-18-38 |
| Voltage | 1.35V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Multi-channel Kit | Dual Channel Kit |
| Chipset | Intel Z370 Platform |
| Color | Gray / Red |
| Heat Spreader | Yes |
| Features | Overclock performance DDR4 memory designed for compatible Intel platforms. Sleek and stylish aluminum heat spreader design. Intel XMP 2.0 Support. Do not mix memory kits. Memory kits are sold in matched kits that are designed to run together as a set. Mixing memory kits will result in stability issues or system failure. Memory kits will boot at the SPD speed at default BIOS settings with compatible hardware. For memory kits with XMP, enable XMP/DOCP/A-XMP in BIOS to reach the rated potential XMP overclock speed of the memory kit, subject to the use of compatible hardware. Reaching th |
| Recommend Use | AMD X570 / X470 / B550 Intel Z790 DDR4 / Z690 DDR4 / Z590 / Z490 / Z390 / Z370 / Z270 |
| 배송 무게 | 0.20 kg |
| 포장 크기 | 157 × 137 × 15 mm |
이 상품에 대한 질문
Should I pick the 32GB dual-channel kit or a single 32GB module?
The 32GB kit ships as two matched 16GB modules tested to run together at DDR4 3200 CL16 16-18-18-38 1.35V. Mixing kits can cause instability, so the dual-channel pair is the supported way to reach the rated XMP 2.0 profile.
What does DDR4 3200 CL16 actually deliver once installed?
With XMP 2.0 enabled on a compatible Intel Z370, Z390, Z490, Z590, Z690 DDR4 or Z790 DDR4 platform, the kit runs at 3200 MT/s with 16-18-18-38 timings at 1.35V. Without XMP it will boot at the standard SPD speed instead.
Does the XMP 2.0 profile work on AMD X570 or B550 boards?
The kit is validated for Intel XMP 2.0 on the listed Z-series chipsets. On AMD X570, X470 or B550 you would enable the equivalent DOCP or A-XMP setting in BIOS; reaching the rated 3200 MT/s CL16 still depends on the specific motherboard and CPU memory controller.
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