BFKK
BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
US$214.99
0.00276032BTC
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G.SKILL
G.SKILL Ripjaws X Series F3-14900CL9D-8GBXL 8GB (2 x 4GB) DDR3 1866 CL9 desktop RAM
Dual-channel 8 GB DDR3 kit at 1866 MT/s with CL9 timing and 1.50 V for Intel LGA1155 and AMD AM3+ platforms
- Capacity8GB (2 x 4GB)
- SpeedDDR3 1866 (PC3 14900)
- CAS LatencyCL9
- Timing9-10-9-28
- Voltage1.50V
- ECCNo
- Dual-channel kit doubles bandwidth for responsive multitasking
- CL9 latency at 1866 MHz speeds up data access
- 50 V operation keeps power draw low
- Red heat spreader improves cooling for stable performance
- XMP 2.0 profile enables automatic overclocking on Intel LGA1155 and AMD AM3+
Ripjaws X DDR3 1866 Kit
This G.SKILL Ripjaws X Series kit provides 8 GB of DDR3 memory in a matched pair of 4 GB modules rated at 1866 MT/s with CL9 timings. It is built for desktop systems that use dual-channel DDR3 architecture.
Suited for LGA1155 and AMD Llano/AM3+
The modules are validated for Intel LGA1155 platforms and AMD Llano or AM3+ platforms, making them a direct fit for 2nd and 3rd Generation Core processors and compatible AMD CPUs. Systems that require ECC, registered DIMMs, or a different DDR generation should select another product.
8 GB dual-channel capacity with XMP 2.0
The 8 GB total capacity handles mainstream workloads and period-correct gaming comfortably, while the XMP 2.0 profile enables automatic configuration at the rated 1866 speed and 9-10-9-28 timings. Memory-intensive modern applications or virtualisation loads will exceed the available headroom.
주요 특징
- Dual-channel kit doubles bandwidth for responsive multitasking
- CL9 latency at 1866 MHz speeds up data access
- 50 V operation keeps power draw low
- Red heat spreader improves cooling for stable performance
- XMP 2.0 profile enables automatic overclocking on Intel LGA1155 and AMD AM3+
사양
| Brand | G.SKILL |
|---|---|
| Series | Ripjaws X Series |
| Model | F3-14900CL9D-8GBXL |
| Capacity | 8GB (2 x 4GB) |
| Speed | DDR3 1866 (PC3 14900) |
| CAS Latency | CL9 |
| Timing | 9-10-9-28 |
| Voltage | 1.50V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Multi-channel Kit | Dual Channel Kit |
| Color | Red |
| Heat Spreader | Yes |
| Features | Compatible with Intel LGA1155 and AMD Llano / AM3+ platforms Intel XMP support for 2nd and 3rd Generation Intel Core Processors |
| 배송 무게 | 0.12 kg |
| 포장 크기 | 206 × 133 × 20 mm |
이 상품에 대한 질문
Will this kit work in a dual-channel motherboard with two DIMM slots?
Yes, it is a dual-channel kit of two 4 GB modules designed for two-slot motherboards.
Does the kit require a voltage higher than 1.50 V to reach its rated speed?
No, the rated DDR3 1866 speed and CL9 timings run at the standard 1.50 V.
Is Intel XMP 2.0 supported for automatic configuration on a 2nd or 3rd Generation Core platform?
Yes, the kit includes XMP 2.0 profiles for those Intel platforms.
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