BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
- Rackmount
G.SKILL
Dual-channel 8 GB DDR3 kit rated at 2400 MT/s with CL10 10-12-12-31 timings at 1.65 V and Intel XMP 1.3 profiles
This 8 GB kit contains two 4 GB DDR3 modules rated for 2400 MT/s at CL10-12-12-31 and 1.65 V. It is built for enthusiasts targeting high-performance or gaming systems on 3rd generation Intel Core platforms such as the Core i7-3770K and Core i5-3570K. Intel XMP 1.3 profiles simplify configuration on compatible Z77 motherboards.
Each module carries the TridentX aluminium heat-spreader with a detachable top fin that increases surface area for airflow. The fin can be removed to lower module height and clear large CPU coolers or custom liquid loops. This flexibility suits both air-cooled and water-cooled builds without changing the memory itself.
The TridentX line set a DDR3 frequency world record of 4404 MT/s in 2012, demonstrating the IC headroom behind these modules. XMP 1.3 support lets the kit load its rated 2400 MT/s timings with a single BIOS selection, removing manual tuning for most users. No additional software or accessories are bundled beyond the two DIMMs.
| Brand | G.SKILL |
|---|---|
| Series | TridentX Series |
| Model | F3-2400C10D-8GTX |
| Capacity | 8GB (2 x 4GB) |
| Speed | DDR3 2400 (PC3 19200) |
| CAS Latency | CL10 |
| Timing | 10-12-12-31 |
| Voltage | 1.65V |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Multi-channel Kit | Dual Channel Kit |
| Features | Designed for 3rd Generation Intel Core Processors and Z77 platform. Intel XMP 1.3 Ready for 3rd Generation Intel Core Processors. Recommended Intel Core i7-3770K processors & Core i5-3570K processors for best performance. Please check gskill.com for motherboard compatibility chart. |
| Recommend Use | High Performance or Gaming Memory |
| 배송 무게 | 0.20 kg |
| 포장 크기 | 206 × 136 × 20 mm |
The kit runs at 2400 MT/s with CL10 10-12-12-31 timings at 1.65V, delivering a peak transfer rate of 19200 MB/s when XMP 1.3 is enabled on a Z77 platform.
The top fins unscrew, lowering the module height so it fits under oversized tower coolers; with fins installed the spreader adds surface area for airflow.
Enable the Intel XMP 1.3 profile in the BIOS after installing both modules in the primary dual-channel slots; the board will then apply the 1.65V, CL10 10-12-12-31 settings automatically.
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