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HP

HP ProLiant DL360 Gen9 1U rack server E5-2643 v3 3.4GHz 96GB 2x 146GB SAS H240ar

SKU CH-VS35-9CBDY

1U rack server with a six-core 3.4 GHz Xeon, 96 GB DDR4 and two 146 GB 15K SAS drives on an H240ar controller

  • TypeRack
  • Rack Height1U
  • Redundant Hot-swap PowerYes
  • CPU TypeIntel Xeon E5 v3
  • MAX Processors2
  • ChipsetIntel C610
  • Six-core Xeon at 3.4 GHz for high single-thread speed
  • 96 GB DDR4 ECC memory fills every slot for maximum capacity
  • Two 146 GB 15K SAS drives deliver fast sequential I/O
  • H240ar controller supports RAID 0/1/5/6/10/50/60 for flexible data protection
  • Dual 500 W hot-swap supplies keep the server running if one fails

Dense 1U rack server with single Xeon E5-2643 v3

The HP ProLiant DL360 Gen9 is a 1U rack server built for compute-heavy workloads in space-constrained environments. It ships with one six-core Intel Xeon E5-2643 v3 processor running at 3.4 GHz and 96 GB of DDR4 ECC registered memory across 24 DIMM slots. Redundant hot-swap 500 W power supplies and a Smart HBA H240ar controller with RAID 0/1/5/6/10/50/60 support complete the platform.

Compute-focused users needing maximum memory per

This configuration suits virtualisation hosts, database nodes or HPC clusters that benefit from high single-thread frequency and a large memory footprint relative to core count. Buyers who need more storage capacity than two 146 GB 15 K SAS drives provide should consider a different drive layout. Organisations requiring dual processors from day one will need to add a second CPU kit.

96 GB DDR4 installed at maximum configured capacity

The system arrives with 96 GB of DDR4 memory installed, which matches the 96 GB maximum listed for this specific configuration. Twenty-four DIMM slots allow expansion up to 3 TB when a second processor is fitted, but the shipping limit is 96 GB. Memory runs at up to 2400 MT/s depending on the installed processor capability.

주요 특징

  • Six-core Xeon at 3.4 GHz for high single-thread speed
  • 96 GB DDR4 ECC memory fills every slot for maximum capacity
  • Two 146 GB 15K SAS drives deliver fast sequential I/O
  • H240ar controller supports RAID 0/1/5/6/10/50/60 for flexible data protection
  • Dual 500 W hot-swap supplies keep the server running if one fails

사양

BrandHP
SeriesProLiant
ModelProliant DL360 G9
TypeRack
Rack Height1U
Redundant Hot-swap PowerYes
CPU TypeIntel Xeon E5 v3
MAX Processors2
ChipsetIntel C610
Installed Memory Size96GB
Memory TypeDDR4
Max Memory Capacity96GB
Memory Features24 DIMM slots, 12 per processor. (4GB/8GB/16GB/32GB/64GB DDR4 up to 2400MT/s ECC Registered, actual memory speed dependent on the processor capability).
Number of Memory Slots24
Storage ControllerHP Smart HBA H240ar Controller
HDD InterfaceSAS
SSD (Installed)No
Raid LevelRAID 0/1/5/6/10/50/60
Media DrivesNone
GPU TypeMatrox G200
Video Memory16MB
Remote ManagementiLO Management (standard).
LAN Ports4 x Ports
Expansion SlotsPrimary Riser: 2 PCIe 3.0 Slots (1 & 2) available: 1x Full-Height Half Length, 1x Half-Lenth Half Height. Optional PCIe 3.0 slot 3 - Full-Height Half Height (Secondary PCIe Riser and dual CPU required).
Operating SystemNo
Compatible/Certified OSMicrosoft Windows Small Business Server 2011/2008, Microsoft Windows Server 2008 R2 SP1/SP2, Microsoft Windows HPC Server 2008 R2, Novell SUSE Linux Enterprise Server, Red Hat Enterprise Linux, Oracle Solaris
Weight63.0000LBS

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이 상품에 대한 질문

What SAS speed does the Smart HBA H240ar controller cap at for the installed drives?

The Smart HBA H240ar supports 12Gb SAS and 6Gb SATA, but the two 146GB 15K drives are 6Gbps SAS units, so the practical link speed is limited to 6Gbps per drive.

What physical space and bay count does this 1U server need for the current drives?

It occupies 1U of rack height and uses two of the eight 2.5-inch SFF bays; the remaining six bays are free for additional 2.5-inch SAS or SATA drives with trays.

How do I install a second processor, and what step is commonly missed?

Install the second Xeon in the empty socket, populate its 12 DIMM slots with matched DDR4 registered ECC modules, and apply the thermal interface material supplied with the heatsink kit — skipping the paste causes overheating.

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