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HP
Two-socket Xeon Gold 6136 12-core rack server with 1TB DDR4, six 1.2TB SAS drives and quad-port NIC
This HP ProLiant DL380 Gen10 rack server is configured with dual Intel Xeon Gold 6136 processors, each running at 3.00GHz with 12 cores. The 1TB of DDR4 memory supports multiple virtual machines, databases and data-heavy applications. Six 1.2TB SAS drives provide storage for operating systems, applications and backups in a 2U chassis with 10 SFF bays. The 331FLR quad-port NIC handles network traffic for virtualization and file services.
The 2U rack-mount design fits standard data-centre cabinets and server rooms where airflow is managed by the facility. Dual processors and 1TB of DDR4 draw consistent power during typical business workloads such as file storage, application hosting and light virtualization. Integrated GPU and the 331FLR quad-port NIC add minimal thermal load. System LEDs show power, Ethernet and USB status for quick visual checks.
With two Xeon Gold 6136 CPUs installed, the server uses its maximum processor capacity for extended database queries, heavy virtualization or ERP tasks. DDR4 SmartMemory scales up to 3TB if workloads grow beyond the installed 1TB. The chassis supports up to 24 SFF hot-plug drives, so storage can expand without replacing the platform. HPE Smart Array RAID protects data during continuous write-heavy operations.
| Brand | HP |
|---|---|
| Type | Rackmount |
| LEDs | Power, Ethernet, USB |
| CPU Type | Gold 6136 |
| CPU Speed | 3.00GHz |
| Number of CPU Cores | 12 |
| # of Processors Installed | 2 |
| MAX Processors | 2 |
| Installed Memory Size | 1TB |
| Memory Type | DDR4 |
| Max Memory Capacity | 3TB |
| GPU Type | Integrated |
| Expansion Bays | 10B - 10x 2.5" |
| Operating System | No |
| Weight | 60 |
Slide each 2.5" drive into a hot-plug carrier until it clicks, then insert into any of the 10 front bays; the step often missed is running the Smart Array configuration utility (F10 at boot) to create the logical RAID volume before installing an OS.
The 12 DIMM slots are fully populated to reach 1TB; future expansion to the 3TB maximum requires replacing existing modules with higher-capacity DDR4 RDIMMs or LRDIMMs, as no empty slots remain.
The dual 12-core processors hit their thermal design power ceiling before the 24 SFF chassis limit or the 331FLR quad-port NIC saturates, so adequate rack airflow is the primary constraint.
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