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Intel
72-core server CPU reaching 3.9 GHz turbo with 432 MB cache, 12-channel DDR5 support up to 3 TB and 96 PCIe 5.0 lanes
The Intel Xeon 6 6960P is a 72-core server processor built for high-density compute. It runs at a 2.7 GHz base frequency and reaches a 3.9 GHz max turbo frequency across its 144 threads. The chip delivers 432 MB of L3 cache and supports up to 3 TB of memory across 12 channels.
This processor fits workloads that need high core counts and large memory capacity in a two-socket design. It is not for buyers who need integrated graphics or single-threaded clock speeds above 3.9 GHz. Builders requiring more than six UPI links or a thermal design power below 500 W should evaluate other options.
The processor installs exclusively into the FCLGA 7529 socket and carries a 500 W thermal design power. Cooling hardware is not included, so a solution rated for this heat output is mandatory. The 3 nm manufacturing node supports DDR5 at 6400 MHz and MRDIMM at 8800 MHz through the integrated memory controller.
| Brand | Intel |
|---|---|
| Series | Xeon 6 |
| Name | Xeon 6960P |
| Model | PK8072006129800 |
| CPU Socket Type | FCLGA 7529 |
| Core Name | Granite Rapids |
| # of Cores | 72-Core |
| # of Threads | 144 |
| Operating Frequency | 2.7 GHz |
| Max Turbo Frequency | Max Turbo Frequency 3.9 GHz All Core Turbo Frequency 3.8 GHz |
| L3 Cache | 432MB |
| 64-Bit Support | Yes |
| Hyper-Threading Support | Yes |
| Manufacturing Tech | 3 nm |
| Integrated Memory Controller Speed | DDR5(6400MHz) MRDIMM(8800MHz) |
| Maximum Memory Capacity | 3TB |
| Memory Channel | 12 Channel |
| Virtualization Technology Support | Yes |
| Scalability | 2S |
| PCI Express Revision | 5.0 |
| Max # of PCI Express Lanes | 96 |
| Multimedia Instruction | Intel AMX, Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512 |
| Thermal Design Power | 500W |
| Cooling Device | Cooling device not included - Processor Only |
| 배송 무게 | 0.12 kg |
| 포장 크기 | 78 × 64 × 57 mm |
Align the processor triangle marker with the socket corner, lower it vertically without force, and close the retention lever until it locks. The 7529-pin land grid array has no pins on the CPU itself; the socket pins are the fragile part.
Replace thermal paste every two to three years and verify the cooler maintains the 500 W TDP under load. Dust the heatsink fins quarterly. No user-serviceable parts exist inside the 3 nm package.
When all 72 cores run at the 3.8 GHz all-core turbo, the package hits its 500 W thermal ceiling. The firmware will then reduce frequency to stay within the power envelope.
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