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Intel
Quad-core server processor with 3.1 GHz base clock, 4.60 GHz turbo, 8 MB L3 cache and integrated UHD Graphics P750 for LGA 1200 platforms
The Intel Xeon E-2324G is a quad-core server processor built for LGA 1200 platforms. It runs at a 3.10 GHz base frequency and reaches a 4.60 GHz maximum turbo frequency. The chip includes 8 MB of L3 cache and integrates Intel UHD Graphics P750. A 65 W thermal design power rating defines its cooling requirement.
This processor suits single-socket servers and workstations that need ECC memory support and integrated graphics for display output. It fits builds limited to a 65 W power envelope and dual-channel DDR4 3200 memory. Buyers needing multi-socket scalability, Hyper-Threading, or more than four threads should look at other Xeon models.
The LGA 1200 socket and dual-channel DDR4 3200 memory controller determine motherboard compatibility. The processor supports up to 128 GB of memory across two channels. A discrete cooler is required because none is included in the retail package.
| Brand | Intel |
|---|---|
| Series | Intel Xeon E |
| Name | Xeon E-2324G |
| Model | BX80708E2324G |
| CPU Socket Type | LGA 1200 |
| Core Name | Rocket Lake |
| # of Cores | Quad-Core |
| # of Threads | 4 |
| Operating Frequency | 3.1 GHz |
| Max Turbo Frequency | 4.60 GHz |
| L3 Cache | 8MB |
| 64-Bit Support | Yes |
| Hyper-Threading Support | No |
| Manufacturing Tech | 14 nm |
| Integrated Memory Controller Speed | DDR4 3200 |
| Maximum Memory Capacity | 128GB |
| Memory Channel | Dual Channel |
| Virtualization Technology Support | Yes |
| Integrated Graphics | Intel UHD Graphics P750 |
| Graphics Base Frequency | 350 MHz |
| Max Dynamic Frequency | 1.30 GHz |
| Scalability | 1S Only |
| PCI Express Revision | 4.0 |
| Max # of PCI Express Lanes | 20 |
| Thermal Design Power | 65W |
| Cooling Device | Cooling device not included - Processor Only |
| 배송 무게 | 0.23 kg |
| 포장 크기 | 203 × 127 × 127 mm |
Align the processor notches with the socket keys, lower it gently without force, then secure the retention lever; the 14 nm Rocket Lake die sits directly under the integrated heat spreader so uneven pressure can damage contacts.
The 65 W thermal design power needs a compatible LGA 1200 cooler rated for at least that dissipation; the retail pack ships without a cooling device so you must supply one before first boot.
The 65 W power limit and 14 nm process constrain all-core turbo duration; sustained workloads will drop toward the 3.10 GHz base frequency once the package hits its thermal envelope.
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