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Intel
32-core server processor with 75 MB L3 cache, DDR5-4800 support and 80 PCIe 5.0 lanes
The Intel Xeon Max 9462 is a 32-core server processor built on 10 nm Sapphire Rapids silicon. It runs at a 2.7 GHz base frequency and reaches 3.5 GHz max turbo across 64 threads. The LGA 4677 package targets two-socket platforms that need high core counts for virtualisation, HPC or large-memory databases.
A 75 MB L3 cache feeds all cores with low-latency data, while the integrated controller drives eight DDR5 channels at up to 4800 MT/s single-DIMM or 4400 MT/s dual-DIMM. This combination raises sustained bandwidth for memory-bound workloads and supports up to 4 TB per socket without extra memory buffers.
The 350 W thermal design power demands robust socket cooling; no cooler ships in the box. Eighty PCI Express 5.0 lanes provide high-speed I/O for accelerators, storage or networking cards. Two-socket scalability lets builders double cores and memory channels within a single chassis.
| Brand | Intel |
|---|---|
| Series | Intel Xeon Max |
| Name | Xeon Max 9462 |
| Model | PK8071305223900 |
| CPU Socket Type | LGA 4677 |
| Core Name | Sapphire Rapids |
| # of Cores | 32-Core |
| # of Threads | 64 |
| Operating Frequency | 2.7 GHz |
| Max Turbo Frequency | 3.5 GHz |
| L3 Cache | 75MB |
| 64-Bit Support | Yes |
| Hyper-Threading Support | Yes |
| Manufacturing Tech | 10 nm |
| Integrated Memory Controller Speed | Up to DDR5 4800 MT/s 1DPC Up to DDR5 4400 MT/s 2DPC |
| Maximum Memory Capacity | 4TB |
| Memory Channel | 8 Channel |
| Virtualization Technology Support | Yes |
| Scalability | 2S |
| PCI Express Revision | 5.0 |
| Max # of PCI Express Lanes | 80 |
| Multimedia Instruction | Intel AMX, Intel SSE4.2, Intel AVX, Intel AVX2, Intel AVX-512 |
| Thermal Design Power | 350W |
| Cooling Device | Cooling device not included - Processor Only |
| 배송 무게 | 0.23 kg |
| 포장 크기 | 127 × 102 × 13 mm |
The processor ships without a cooler, so a 350 W-rated LGA 4677 heatsink or liquid block must be sourced separately.
Turbo drops when the 350 W power envelope or the 10 nm silicon thermal limit is reached, whichever occurs first under continuous load.
Expect continuous 350 W heat output; acoustic level depends entirely on the third-party cooler chosen for the LGA 4677 socket.
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