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가격 추적 로그인
Two green DDR4 RDIMM modules, no heat spreaders, gold edge connectors, black chips

NEMIX RAM

NEMIX RAM 128GB 2x64GB DDR4 3200MHz PC4-25600 CL22 2Rx4 1.2V 288-Pin ECC Registered RDIMM Kit memory upgrade

SKU CH-78J5-CP37A

128 GB DDR4 3200 MHz ECC registered RDIMM kit with 2Rx4 ranks and 1.2 V operation for Supermicro X12SPA-TF

  • Capacity128GB (2 x 64GB)
  • Type288-Pin DDR4 RDIMM
  • SpeedDDR4 3200 (PC4 25600)
  • CAS LatencyCL22
  • Voltage1.20V
  • ECCYes

Size 128GB 2X64GB

구성 8개 더 보기
  • 128 GB capacity from two 64 GB modules expands server memory headroom
  • DDR4 3200 speed with CL22 latency delivers rated throughput for demanding workloads
  • ECC registered design detects and corrects single-bit errors to protect data integrity
  • 2 V operation at 2Rx4 rank matches the memory controller requirements exactly
  • 288-pin RDIMM form factor fits the Supermicro X12SPA-TF motherboard slot precisely

Targeted Server Memory Upgrade

This 128GB kit delivers two 64GB DDR4 RDIMMs rated at 3200MHz with CL22 timing. It is built for administrators upgrading a Supermicro X12SPA-TF motherboard that requires registered ECC modules. The exact 2Rx4 rank structure and 1.20V voltage match the board's memory controller expectations for full-capacity recognition.

Thermals Noise and Power Draw

Operating at the standard DDR4 1.20V level, these modules draw minimal power per DIMM under typical server loads. Without integrated heat spreaders, they rely on the chassis airflow that server platforms already provide. The registered architecture reduces electrical load on the memory controller, contributing to stable operation in fully populated configurations.

Build Quality and Connector Implications

Each stick uses the 288-pin RDIMM form factor with ECC and registered buffering for error correction and signal integrity. Major OEM chips from Samsung, Micron or Hynix underlie the modules. The lack of heat spreaders keeps the profile low for dense slot spacing, while the registered design allows every supported slot to be filled without signal degradation.

주요 특징

  • 128 GB capacity from two 64 GB modules expands server memory headroom
  • DDR4 3200 speed with CL22 latency delivers rated throughput for demanding workloads
  • ECC registered design detects and corrects single-bit errors to protect data integrity
  • 2 V operation at 2Rx4 rank matches the memory controller requirements exactly
  • 288-pin RDIMM form factor fits the Supermicro X12SPA-TF motherboard slot precisely

사양

BrandNEMIX RAM
SeriesNEMIX RAM Original Series Server Memory
ModelDDR4 ECC RDIMM Registered Server Memory
Part NumberMR25600-924K2
Capacity128GB (2 x 64GB)
Type288-Pin DDR4 RDIMM
SpeedDDR4 3200 (PC4 25600)
CAS LatencyCL22
Voltage1.20V
ECCYes
Buffered/RegisteredRegistered
Rank2Rx4
ChipsetMajor OEM Samsung, Micron, Hynix
Heat SpreaderNo
Compatible SystemSupermicro
FeaturesDDR4 ECC RDIMM Motherboard Compatible
Package Content128GB 2X64GB DDR4 3200MHz PC4-25600 2Rx4 1.2V 288-PIN ECC RDIMM KIT

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이 상품에 대한 질문

How do I install the 288-pin DDR4 RDIMM modules in the Supermicro X12SPA-TF and which slot order does the manual require?

Power down the server, open the chassis, and insert each 64GB module into the DIMM slots specified by the Supermicro X12SPA-TF manual for a two-DIMM population; the registered design means every populated slot must follow the exact sequence the board documentation lists.

Will the Samsung, Micron or Hynix DRAM chips on these registered ECC DIMMs need any firmware updates or periodic replacement?

The modules use major OEM DRAM from Samsung, Micron or Hynix and carry a lifetime replacement warranty; no firmware updates are required and the chips are not a user-replaceable component under normal operation.

At what point does the CL22 latency at 3200MHz become the bottleneck during sustained server workloads?

The CAS latency of 22 cycles at 3200MHz sets the minimum access delay; under continuous heavy traffic the memory controller waits those cycles for every column request, so latency — not bandwidth — is the first limit you hit.

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