BFKK
BFKK 3U Rackmount Server Chassis EATX/ATX/MATX 4x5.25 6x3.5 Top/Side Cooling
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NEMIX RAM
NEMIX RAM 16GB (2x8GB) DDR4 3200 CL22 288-Pin UDIMM ASRock B550M-HDV memory upgrade
A 16 GB DDR4 3200 CL22 kit of two 8 GB 1.2 V UDIMMs validated for the ASRock B550M-HDV motherboard
- Capacity16GB (2 x 8GB)
- SpeedDDR4 3200 (PC4 25600)
- ECCNo
- Buffered/RegisteredUnbuffered
- ChipsetMajor OEM Samsung, Micron, Hynix
- Voltage1.20V
- 16GB dual-channel kit boosts multitasking with 3200 MT/s DDR4 speed
- CL22 latency keeps response tight for everyday workloads
- 20V operation reduces power draw and heat
- 288-pin UDIMM fits ASRock B550M-HDV without adapters
- Major-brand DRAM chips validated under load for stability
16 GB DDR4 kit for ASRock B550M-HDV
This 16 GB kit contains two 8 GB DDR4 UDIMMs built for the ASRock B550M-HDV motherboard. It is intended for desktop owners who want a straightforward capacity increase without configuration hassle. The modules are validated for that specific board to ensure reliable operation.
CL22 latency at 3200 MT/s
The memory runs at DDR4 3200 (PC4-25600) with a CAS latency of CL22 and operates at 1.2 V. These three figures determine whether the kit matches the board's supported speed grade and timing window. No heat spreaders are fitted, so clearance is not a concern in compact builds.
Suits B550M-HDV owners needing 16 GB
Builders upgrading an ASRock B550M-HDV system to 16 GB will find this kit a direct fit. Users who require ECC error correction, registered modules, lower latency than CL22, speeds above 3200 MT/s, or capacities beyond 16 GB should look at other memory lines.
주요 특징
- 16GB dual-channel kit boosts multitasking with 3200 MT/s DDR4 speed
- CL22 latency keeps response tight for everyday workloads
- 20V operation reduces power draw and heat
- 288-pin UDIMM fits ASRock B550M-HDV without adapters
- Major-brand DRAM chips validated under load for stability
사양
| Brand | NEMIX RAM |
|---|---|
| Series | ASRock Gaming Motherboard Compatible Series Memory |
| Model | ASRock DDR4 3200MHZ Non-ECC Unbuffered UDIMM |
| Part Number | MD25600-818K2 |
| Capacity | 16GB (2 x 8GB) |
| Speed | DDR4 3200 (PC4 25600) |
| ECC | No |
| Buffered/Registered | Unbuffered |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Voltage | 1.20V |
| Compatible System | ASRock |
| CAS Latency | CL22 |
| Heat Spreader | No |
| Type | 288-Pin DDR4 UDIMM |
| Rank | 1Rx8 |
| Features | DDR4 Non- ECC Unbuffered UDIMM Motherboard Compatible |
| Package Content | 16GB (2X8GB) DDR4 3200MHZ PC4-25600 1Rx8 1.2V CL22 288-PIN Non-ECC Unbuffered UDIMM KIT |
이 상품에 대한 질문
What does the CL22 latency figure mean once the kit is installed?
CL22 is the CAS latency rating; the memory controller waits 22 clock cycles before data becomes available, so lower values would respond faster at the same 3200 MT/s rate.
How does the DDR4 3200 (PC4-25600) standard limit real-world throughput?
The DDR4 3200 standard sets the maximum data rate at 3200 MT/s; actual throughput depends on the motherboard memory controller and whether the two 8 GB modules run in dual-channel mode.
What physical clearance is needed for these 288-pin UDIMM modules?
Each stick is a standard-height 288-pin DDR4 UDIMM without a heat spreader, so it fits any desktop slot with normal vertical clearance and no oversized CPU cooler overhang.
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