Phobya
Phobya Thermal Pad Ultra 5W/mk 30x30x.5mm 17068
A flexible 30×30×.5 mm thermal pad rated at 5 W/mK that conforms to uneven surfaces and can be trimmed for VRAM, VRM or chipset cooling
- FeaturesThese thermal pads are perfectly suited to equalize height d
- Equalises cooler and component height differences with flexible, low-hardness pad
- Conforms to surfaces at low contact pressure thanks to very flexible structure
- Bridges microscopic to visible surface irregularities for consistent thermal contact
- Slightly sticky surface with protective foil prevents pad movement after installation
- 30 x 30 x .5 mm pad can be cut to fit VRAM, VRM or bridge chips
Phobya Thermal Pad Ultra 5W/mk
This 30x30x.5mm thermal pad fills gaps between coolers and components such as VRAM or VRM modules. Its flexible, low-hardness structure conforms to uneven surfaces at low contact pressures. A slightly sticky surface with protective foil prevents movement during installation. The pad can be trimmed to custom shapes for various cooling applications.
Practical limits of a 5W/mk thermal pad
Thermal pads transfer heat through bulk conductivity rather than the thin bond lines achievable with paste. The .5mm thickness sets a minimum gap the pad can bridge without excessive compression. Conductivity of 5W/mk suits memory and VRM cooling but may be insufficient for high-power dies requiring direct-die contact. Reuse is not recommended once the pad has compressed and lost its original thickness.
Replaces stock pads and basic gap fillers
Upgrading from factory-fitted pads or generic 1–2W/mk sheets reduces thermal resistance on memory and voltage-regulator modules. The jump is worthwhile when original pads are dried out, too thin for uneven surfaces, or when overclocking raises component temperatures. Builders needing thinner or thicker gaps, or those requiring electrically insulating sheets with different conductivity ratings, should select a different specification.
주요 특징
- Equalises cooler and component height differences with flexible, low-hardness pad
- Conforms to surfaces at low contact pressure thanks to very flexible structure
- Bridges microscopic to visible surface irregularities for consistent thermal contact
- Slightly sticky surface with protective foil prevents pad movement after installation
- 30 x 30 x .5 mm pad can be cut to fit VRAM, VRM or bridge chips
사양
| Brand | Phobya |
|---|---|
| Model | 17068 |
| Part Number | 17068 |
| Features | These thermal pads are perfectly suited to equalize height differences and uneven spots on coolers and cooled elements. The very flexible structure and low hardness allow great adaptivity to the cooling surface even at low contact pressures. The thermal pad equalizes the effect of irregularities from microscopic scale to visible scratches etc. |
이 상품에 대한 질문
Which thickness should I pick for a 0.5 mm gap?
The pad measures 0.5 mm thick, so it matches a half-millimetre gap exactly.
How much heat does the 5 W/m·K rating actually move in a GPU or motherboard VRM?
At 5 W/m·K the pad conducts heat efficiently across VRAM, VRM or chipset surfaces, closing microscopic to visible gaps even under light mounting pressure.
Is there an electrical or thermal standard this pad conforms to?
No specific standard is cited; the pad is a 30 × 30 mm, 0.5 mm thick silicone interface with 5 W/m·K conductivity and a slightly tacky surface.
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