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Supermicro

Supermicro MBD-X12SPO-NTF-O ATX server motherboard LGA 4189

SKU CH-AB9H-TS7W1 MPN MBD-X12SPO-NTF-O

ATX server board for 3rd Gen Intel Xeon Scalable CPUs with eight DDR4-3200 slots, dual 10GbE LAN, ten SATA 6.0Gb/s ports and two M.2 sockets

  • CPU Socket TypeLGA 4189
  • CPU TypeSupports 3rd Gen Intel Xeon Scalable processors
  • North BridgeIntel C621A
  • Number of DDR4 Slots8 x 288-pin
  • DDR4 StandardDDR4 3200
  • Maximum Memory Supported2TB
  • Supports 3rd Gen Intel Xeon Scalable processors up to 270W TDP via LGA 4189 socket
  • Eight DDR4 3200 slots deliver up to 2TB ECC memory capacity for demanding workloads
  • Dual Intel X550 controllers provide two 10Gbps LAN ports for high-throughput networking
  • Ten SATA 6.0Gb/s ports with RAID 0/1/5/10 plus two M.2 slots for flexible storage configurations
  • Single PCI Express 4.0 x16 slot and five PCI-E 4.0 NVMe x8 internal ports enable high-speed expansion

Single-socket ATX server board

The Supermicro MBD-X12SPO-NTF-O is an ATX motherboard built around the Intel C621A chipset and a single LGA 4189 socket. It accepts 3rd Gen Intel Xeon Scalable processors with a thermal design power up to 270 W. Eight 288-pin DDR4 3200 slots support ECC RDIMM, LRDIMM and Intel Optane Persistent Memory up to 2 TB total capacity. Dual Intel X550 controllers provide two 10 Gbps LAN ports for high-throughput networking.

Upgrade from single 10 GbE or SATA-only platforms

Builders moving from a board with only one 10 GbE port or purely SATA storage gain a second 10 Gbps link plus ten SATA 6.0 Gb/s ports with RAID 0/1/5/10. The jump is worthwhile when a workload needs simultaneous high-speed networking and dense local storage without adding extra controller cards. It is not for buyers who want more than one PCI Express 4.0 x16 slot or who require integrated Wi-Fi or Bluetooth connectivity.

PCIe 4.0 x16 and NVMe x8 limits

The board exposes one PCI Express 4.0 x16 slot and five PCIe 4.0 NVMe x8 internal ports, so total lane budget is shared between the graphics or accelerator card and high-speed storage. M.2 sockets operate at PCIe 3.0 x4 or SATA, limiting attached drives to that generation’s bandwidth. USB 3.2 Gen 1 headers and rear ports top out at 5 Gbps, and the Aspeed AST2600 provides only basic 2D display output for management.

주요 특징

  • Supports 3rd Gen Intel Xeon Scalable processors up to 270W TDP via LGA 4189 socket
  • Eight DDR4 3200 slots deliver up to 2TB ECC memory capacity for demanding workloads
  • Dual Intel X550 controllers provide two 10Gbps LAN ports for high-throughput networking
  • Ten SATA 6.0Gb/s ports with RAID 0/1/5/10 plus two M.2 slots for flexible storage configurations
  • Single PCI Express 4.0 x16 slot and five PCI-E 4.0 NVMe x8 internal ports enable high-speed expansion

사양

BrandSUPERMICRO
ModelMBD-X12SPO-NTF-O
CPU Socket TypeLGA 4189
CPU TypeSupports 3rd Gen Intel Xeon Scalable processors
North BridgeIntel C621A
Number of DDR4 Slots8 x 288-pin
DDR4 StandardDDR4 3200
Maximum Memory Supported2TB
ECC SupportedYes
PCI Express 4.0 x161
SATA10 x SATA 6.0Gb/s
SATA RAID0/1/5/10
M.2M.2 Interface: 2 SATA/PCI-E 3.0 x4
Form Factor: 2280/22110
Key: M-Key
Onboard Video ChipsetAspeed AST2600
LAN ChipsetIntel X550
LAN Speed10Gbps
Second LAN ChipsetIntel X550
Second LAN Speed10Gbps
Max LAN Speed2 x 10Gbps
USB 1.1/2.02 x USB 2.0
USB 3.03 x USB 3.2 Gen1 (2 rear + 1 Type A)
Onboard USB2 x USB 2.0 (via headers)
2 x USB 3.2 Gen 1 (via headers)
Form FactorATX
Dimensions (W x L)12" x 10"
배송 무게1.54 kg
포장 크기462 × 373 × 91 mm

이 상품에 대한 질문

Will the ATX form factor and 12" x 10" dimensions fit my standard server chassis?

The board uses the ATX form factor measuring 12" x 10", matching standard ATX mounting holes and I/O shield cutouts in compatible server chassis.

What is the correct sequence for installing a 3rd Gen Intel Xeon Scalable processor into the LGA 4189 socket?

Align the processor notches with the socket keys, lower it gently without force, then secure the retention mechanism before attaching the heatsink.

When should the DDR4 3200 ECC RDIMM or LRDIMM modules be replaced if correctable error counts rise?

Replace modules when the system logs show increasing correctable ECC errors, indicating cell degradation before uncorrectable failures occur.

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