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M.2 2280 internal SSD with thin graphene heatsink, black circuit board, gold edge connector

Team Group

Team Group TM8FFH002T0C129 2TB internal SSD

SKU CH-5JTN-MM2PA MPN TM8FFH002T0C129

M.2 2280 internal SSD with 2TB capacity, PCIe 4.0 x4 interface, up to 7400 MBps read and 6800 MBps write, 1480TB endurance, DRAM cache and graphene heatsink

  • Device TypeInternal Solid State Drive (SSD)
  • Used ForConsumer
  • Form FactorM.2 2280
  • Capacity2TB
  • Memory ComponentsTLC
  • InterfacePCIe 4.0 x4 with NVMe 1.4

Options 2TB

  • Fast game loads backed by up to 7400 MBps sequential read
  • Large project writes accelerated by up to 6800 MBps sequential write
  • Heavy workload endurance supported by 1480TB total bytes written
  • Cool operation maintained by patented graphene heatsink
  • Responsive multitasking enabled by 2GB DRAM cache

T-FORCE G70 PRO Graphene 2TB

The T-FORCE G70 PRO Graphene is a 2TB internal solid state drive built for consumer desktops and laptops. It uses an M.2 2280 form factor and connects through a PCIe 4.0 x4 interface with NVMe 1.4 protocol. An InnoGrit controller and 2GB DRAM cache support sustained performance for gaming and heavy workloads.

PCIe 4.0 x4 interface limits

The PCIe 4.0 x4 link caps theoretical throughput at roughly 8GBps, so real-world speeds top out near the drive’s rated 7400 MBps read and 6800 MBps write. Bandwidth scales with queue depth and workload type; random small-block transfers will not reach sequential peaks. The NVMe 1.4 protocol adds namespace management and endurance features but does not raise the bus ceiling.

2TB capacity with 1480TBW endurance

At 2TB the drive holds large game libraries, media projects and operating systems with ample headroom. The 1480TBW rating means typical consumer write workloads will exhaust warranty endurance only after many years. Sustained heavy writes such as continuous video capture or database logging will consume the budget faster and may trigger thermal throttling under the 0°C to 70°C operating range.

주요 특징

  • Fast game loads backed by up to 7400 MBps sequential read
  • Large project writes accelerated by up to 6800 MBps sequential write
  • Heavy workload endurance supported by 1480TB total bytes written
  • Cool operation maintained by patented graphene heatsink
  • Responsive multitasking enabled by 2GB DRAM cache

사양

BrandTeam Group
SeriesT-FORCE G70 PRO Graphene
ModelTM8FFH002T0C129
Device TypeInternal Solid State Drive (SSD)
Used ForConsumer
Form FactorM.2 2280
Capacity2TB
Memory ComponentsTLC
InterfacePCIe 4.0 x4 with NVMe 1.4
ProtocolNVMe 1.4
ControllerInnoGrit
Cache2GB DRAM
Max Sequential ReadUp to 7400 MBps
Max Sequential WriteUp to 6800 MBps
Terabytes Written (TBW)1480TB
FeaturesThe new gaming performance guardian
Preset controller solutions
Different caching grading systems offered to cover users’ needs
Different heat dissipation modules for different needs
Optimized performance operation that balances reliability and lifetime
Smart product status monitoring system
An environmental protector conserving the Earth
Patented graphene heatsink
Operating Temperature0°C ~ +70°C
Storage Temperature-40°C ~ +85°C
Operating HumidityRH 90% under 40°C (operational)
Max Shock Resistance1,500G/0.5ms
Max Vibration Resistance80Hz~2,000Hz/20G
Height2.25mm
Width22mm
Depth80mm
Weight7g
배송 무게0.02 kg
포장 크기127 × 99 × 23 mm

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이 상품에 대한 질문

Will the M.2 2280 form factor fit my motherboard or PS5 expansion slot?

The drive uses the M.2 2280 form factor, which is the standard size for most desktop motherboards and meets the PS5 console heat-sink regulations for internal expansion.

Does the 2TB capacity provide enough endurance for heavy gaming and content creation?

With a 1480 TBW rating and TLC memory, the SSD is rated for very high write volumes, suitable for large game libraries, video editing and frequent system imaging.

What cooling does the graphene heatsink provide and is extra cooling needed?

The patented ultra-thin graphene heatsink is designed to keep the controller within the 0 °C to 70 °C operating range without requiring an additional motherboard heatsink or active airflow.

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