Thermal Grizzly
Thermal Grizzly Minus Pad 8 120x20x0.5mm 2pack TG-MP8-1202005-2R
High-conductivity thermal pads measuring 120 by 20 by 0.5 millimetres, rated at 8.0 W/mK for efficient heat transfer
- 0 W/mK conductivity moves heat fast from VRM or GPU
- Two 120×20×0.5 mm pads cover larger components in one pack
- Operates from -100 °C to +250 °C for extreme cooling setups
- Light-brown non-conductive silicone avoids short-circuits on dense boards
Thermal Pad for Component Cooling
Thermal Grizzly Minus Pad 8 delivers 8.0 W/mK thermal conductivity in a light brown pad measuring 120 by 20 by 0.5 millimetres. The two-pack format suits builders addressing multiple hot spots such as VRM arrays, memory modules or small chipset heatsinks. Operating range spans -100 °C to +250 °C for extreme environments.
Gap Filler for Tight Tolerances
The 0.5 mm thickness conforms to narrow gaps without excessive pressure on delicate dies. Pre-cut dimensions reduce trimming time during assembly. The pack provides a spare piece for future maintenance or a second board. Builders needing thicker pads or larger sheets must source alternative sizes.
주요 특징
- 0 W/mK conductivity moves heat fast from VRM or GPU
- Two 120×20×0.5 mm pads cover larger components in one pack
- Operates from -100 °C to +250 °C for extreme cooling setups
- Light-brown non-conductive silicone avoids short-circuits on dense boards
사양
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이 상품에 대한 질문
What is the maximum operating temperature of the Minus Pad 8 before it degrades?
The pad is rated for continuous operation up to 250°C, well above typical component junction temperatures.
How much power does the pad draw during sustained thermal transfer?
As a passive thermal interface material, it consumes zero power while conducting heat between surfaces.
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