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ATX motherboard with dark heatsinks, integrated I/O cover and L-shaped heatpipe

ASUS

ASUS ROG STRIX Z890-H GAMING WIFI S RO JI EDITION International Version Intel motherboard

SKU CH-QQP6-PSK83

LGA 1851 ATX motherboard with 16 plus 1 plus 1 plus 2 80A power stages, DDR5 support, PCIe 5.0 and AI-enhanced overclocking, cooling and networking

  • Ready for Intel Core Ultra Series 2 processors via LGA 1851 socket
  • 16+1+1+2 80A power stages with ProCool II connectors deliver stable power
  • AI Overclocking, AI Cooling II and AI Networking II automate tuning
  • DIMM Fit, DIMM Flex and AEMP III simplify DDR5 memory setup
  • Massive heatsinks with integrated I/O cover and L-shaped heatpipe enhance cooling

RO JI Limited Edition Motherboard

The ASUS ROG STRIX Z890-H GAMING WIFI S RO JI EDITION is a limited-release Intel motherboard built for the LGA 1851 socket. It supports Intel Core Ultra Series 2 processors and targets enthusiasts who want an Advanced AI PC-ready platform with distinctive styling.

Upgrade Path for AI Workloads

This board replaces an older Z-series motherboard when the build moves to Intel Core Ultra Series 2 and demands the 16+1+1+2 80A power-stage design. The jump is worth it when NPU Boost, AI Overclocking, AI Cooling II and AI Networking II are needed for sustained AI compute and high DDR5 speeds via DIMM Fit, DIMM Flex and AEMP III.

Enthusiasts Seeking Exclusive AI Features

Builders who want the RO JI special edition aesthetics combined with ASUS-exclusive AI technologies and a robust thermal layout using massive heatsinks and an L-shaped heatpipe will fit this board. Buyers who need a different form factor or who do not require the AI-focused feature set should look at other options.

Najważniejsze cechy

  • Ready for Intel Core Ultra Series 2 processors via LGA 1851 socket
  • 16+1+1+2 80A power stages with ProCool II connectors deliver stable power
  • AI Overclocking, AI Cooling II and AI Networking II automate tuning
  • DIMM Fit, DIMM Flex and AEMP III simplify DDR5 memory setup
  • Massive heatsinks with integrated I/O cover and L-shaped heatpipe enhance cooling

Specyfikacja

Na razie brak opublikowanej specyfikacji tego produktu.

Pytania dotyczące tego produktu

What case clearance do the massive heatsinks with integrated I/O cover and L-shaped heatpipe need?

The large heatsink assembly extends over the I/O area, so verify your chassis has enough height above the motherboard tray for the integrated cover and heatpipe.

Which step is often missed when connecting the ProCool II power connectors for the 16+1+1+2 80A power stages?

Both ProCool II connectors must be seated completely; a partially inserted connector leaves part of the VRM unpowered and can cause instability.

How should the high-conductivity thermal pads on the heatsinks be maintained over time?

Inspect the pads during any major rebuild; replace them if they have dried out or lost contact to keep heat transfer effective.

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