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Cooler Master

Cooler Master E1 IC Essential Thermal Paste 1.5 ml

SKU CH-AJB2-MPS41

High-density thermal paste with 4.5 W/m-K conductivity includes scraper and cleanser for easy CPU application

  • Specifications• Thermal Conductivity(W/m-K): > 4.5 • Specific Gravity(25&#
  • Features• High Thermal Conductivity • Low Thermal Resistance • Elect
  • High thermal conductivity above 4.5 W/m-K for efficient heat transfer
  • Low thermal impedance under 0.185 °C-in²/W reduces CPU temperatures
  • Electrically non-conductive with 1.0E+10 ohm-cm resistivity prevents short circuits
  • Non-curing formula stays effective without drying out over time
  • Includes scraper and grease cleanser for easy application and cleanup

Cooler Master E1 IC Essential Thermal Paste 1.5 ml

Cooler Master E1 IC Essential Thermal Paste is a high-density compound designed for CPU and GPU heat-sink interfaces. The 1.5 ml syringe supplies enough material for several applications. It is electrically non-conductive, non-curing, non-capacitive and non-corrosive, making it safe for direct die contact. A scraper and grease cleanser pack are included for preparation and clean-up.

Thermal conductivity over 4.5 W/m-K

The key specification is thermal conductivity rated above 4.5 W/m-K at 25 °C. This value determines how effectively heat moves from the processor lid into the cooler base. Thermal impedance is specified below 0.185 °C-in²/W, indicating low resistance across the bond line. Volume resistivity reaches 1.0E+10 ohm-cm, confirming electrical isolation. Specific gravity measures 2.5, reflecting the dense particle loading that enables the high conductivity.

Low thermal resistance in normal use

In typical operation the paste remains stable without curing, so thermal resistance does not increase over time. The non-capacitive and non-corrosive formulation protects surrounding components while maintaining consistent contact. Because the compound is electrically non-conductive, accidental overflow onto the substrate or socket area will not cause shorts. The included cleanser simplifies removal during maintenance or upgrades.

Najważniejsze cechy

  • High thermal conductivity above 4.5 W/m-K for efficient heat transfer
  • Low thermal impedance under 0.185 °C-in²/W reduces CPU temperatures
  • Electrically non-conductive with 1.0E+10 ohm-cm resistivity prevents short circuits
  • Non-curing formula stays effective without drying out over time
  • Includes scraper and grease cleanser for easy application and cleanup

Specyfikacja

BrandCooler Master
SeriesIC Essential
ModelE1
Specifications• Thermal Conductivity(W/m-K): > 4.5 • Specific Gravity(25&#8451;): 2.5 • Volume Resistivity (ohm-cm): 1.0E+10 • Thermal Impedance(&#8451;-in2W): < 0.185
Features• High Thermal Conductivity • Low Thermal Resistance • Electrically Non-Conductive • Non-Curing • Non-Capacitive • Non-Corrosive • Grease cleanser included for easy cleaning away old thermal grease. • Come with Scraper for easy to spread.

Pytania dotyczące tego produktu

What does the 4.5 W/m-K thermal conductivity mean for my CPU temperatures?

The 4.5 W/m-K rating indicates high thermal conductivity, allowing efficient heat transfer from the CPU to the cooler for lower operating temperatures.

How does the electrical resistivity of 1.0E+10 ohm-cm affect installation safety?

The high volume resistivity makes the paste electrically non-conductive, preventing short circuits if it contacts motherboard components.

What does the 1.5 ml syringe volume provide for mounting?

The 1.5 ml syringe includes a scraper for precise application and a grease cleanser pack for removing old compound before mounting.

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