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Green printed circuit board M.2 2280 SSD with black label and gold edge connector

Crucial

Crucial T705 CT2000T705SSD3 2TB internal SSD

SKU CH-HJAT-CNMR3 MPN CT2000T705SSD3

2TB PCIe 5.0 NVMe M.2 2280 drive reaching 14,500 MB/s read and 12,700 MB/s write for gaming and creative workloads

  • Device TypeInternal Solid State Drive (SSD)
  • Used ForConsumer
  • Form FactorM.2 2280
  • Capacity2TB
  • Memory ComponentsTLC NAND²
  • InterfacePCI-Express 5.0 x4

Options 2TB

  • Blazing sequential reads up to 14,500 MB/s for instant file access
  • Rapid random performance with 1,550,000 IOPS reads for responsive multitasking
  • PCIe 5.0 x4 interface delivers extreme bandwidth for demanding workloads
  • Copper-clad label transfers heat to motherboard heatsink for sustained speed
  • Micron 232-layer TLC NAND built for Intel Core 13/14th Gen and AMD Ryzen 7000 CPUs

2TB PCIe 5.0 NVMe SSD

The Crucial T705 CT2000T705SSD3 is a 2TB internal solid-state drive built on PCI-Express 5.0 x4 with NVMe protocol. It uses Micron 232-layer TLC NAND to reach sequential reads up to 14,500 MBps and writes up to 12,700 MBps. The M.2 2280 form factor fits standard desktop slots.

Best for Gen5 platforms needing maximum throughput

This drive suits builders with Intel Core 13-14th Gen or AMD Ryzen 7000 CPUs and a motherboard heatsink ready for the copper-clad label. Random performance reaches 1,550,000 read IOPS and 1,800,000 write IOPS. Systems limited to PCIe 4.0 or lacking M.2 cooling should consider a Gen4 alternative.

Requires motherboard heatsink for sustained speed

The T705 ships without a heatsink and relies on the motherboard's M.2 thermal solution to transfer heat via its copper-clad label. Without adequate cooling the controller will throttle, reducing the headline 14,500 MBps read and 12,700 MBps write figures. Verify your board includes a compatible M.2 heatsink before purchase.

Najważniejsze cechy

  • Blazing sequential reads up to 14,500 MB/s for instant file access
  • Rapid random performance with 1,550,000 IOPS reads for responsive multitasking
  • PCIe 5.0 x4 interface delivers extreme bandwidth for demanding workloads
  • Copper-clad label transfers heat to motherboard heatsink for sustained speed
  • Micron 232-layer TLC NAND built for Intel Core 13/14th Gen and AMD Ryzen 7000 CPUs

Specyfikacja

BrandCrucial
SeriesT705
ModelCT2000T705SSD3
Part NumberCT2000T705SSD3
Device TypeInternal Solid State Drive (SSD)
Used ForConsumer
Form FactorM.2 2280
Capacity2TB
Memory ComponentsTLC NAND²
InterfacePCI-Express 5.0 x4
ProtocolNVMe
Max Sequential ReadUp to 14,500 MBps
Max Sequential WriteUp to 12,700 MBps
4KB Random ReadUp to 1,550,000 IOPS
4KB Random WriteUp to 1,800,000 IOPS
HeatSinkwithout HeatSink
Features* EXTREME GEN5 SPEEDS: Get sequential reads/writes of up to 14,500/12,700MB/s and random read/writes of up to 1,550K/1,800K IOPS for blazing performance
* ULTIMATE GAMING & CREATIVITY: Load AAA game titles up to 15% faster than Gen4 SSDs with Microsoft DirectStorage. Experience the future of gaming with up to faster texture renders and reduced load times, render photos or UHD/8K+ videos, and run heavy workloads with up to less CPU utilization.
*EASY TO INSTALL: Ready for performance with your motherboard heatsink, the T705 installs easily in your M.2 slot. Its copper-clad label is de
Waga przesyłki0.24 kg
Wymiary opakowania130 × 99 × 14 mm

Inne wersje tego modelu

Jeszcze 5 w tej samej serii

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Pytania dotyczące tego produktu

Does the CT2000T705SSD3 include a heatsink or do I need to use the motherboard one?

The drive ships without a heatsink and relies on the motherboard M.2 heatsink; its copper-clad label transfers heat to that cooler.

Which capacity should I choose between the 2TB model and other sizes?

The 2TB CT2000T705SSD3 gives 14,500 MBps read and 12,700 MBps write; smaller capacities typically show lower sequential figures.

What does the 14,500 MBps headline speed mean once the SSD is installed in my PC?

That is the maximum sequential read over PCI-Express 5.0 x4; real-world throughput depends on motherboard cooling, workload and CPU generation.

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