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Green circuit board with black memory chips and gold edge connector

NEMIX RAM

NEMIX RAM 8GB DDR4 3200 CL22 SODIMM Samsung Compatible memory upgrade

SKU CH-KZQM-ZTSG0

An 8 GB DDR4 3200 SODIMM with CL22 latency, 1.2 V operation and 260-pin layout for compatible Samsung laptops and all-in-one PCs

  • Capacity8GB
  • SpeedDDR4 3200 (PC4 25600)
  • ECCNo
  • Buffered/RegisteredUnbuffered
  • ChipsetMajor OEM Samsung, Micron, Hynix
  • Voltage1.20V
  • 8 GB DDR4 3200 MHz expands laptop memory capacity
  • CL22 timing at 1.2 V delivers stable system responsiveness
  • 260-pin SODIMM fits Samsung M471A1K43EB1-CWE compatible slots
  • Single-rank 1Rx8 organisation simplifies installation in supported devices
  • Built with Samsung, Micron or Hynix chips for reliable operation

What this module is and who it is for

This is an 8 GB DDR4 3200 SODIMM built to match Samsung M471A1K43EB1-CWE specifications. It runs at 1.20 V with CL22 latency and uses a 1Rx8 unbuffered layout. The 260-pin form factor fits compatible Samsung laptops and all-in-one PCs.

Who it suits and who should look elsewhere

It suits owners of Samsung systems that accept PC4-25600 SODIMMs and want a straightforward capacity increase. Builders needing ECC, registered DIMMs, a different voltage or a higher frequency should look elsewhere.

The specification that decides fit

The module is a 260-pin DDR4 SODIMM rated at DDR4 3200 (PC4-25600) with CL22 timing at 1.20 V. If the target device requires a different pin count, voltage or speed grade, this part will not work.

Najważniejsze cechy

  • 8 GB DDR4 3200 MHz expands laptop memory capacity
  • CL22 timing at 1.2 V delivers stable system responsiveness
  • 260-pin SODIMM fits Samsung M471A1K43EB1-CWE compatible slots
  • Single-rank 1Rx8 organisation simplifies installation in supported devices
  • Built with Samsung, Micron or Hynix chips for reliable operation

Specyfikacja

BrandNEMIX RAM
SeriesSamsung Laptop, AIO All-in-One PC Compatible Series Memory
ModelSamsung DDR4 3200MHZ Non-ECC Unbuffered SODIMM
Part NumberMS25600-818K1
Capacity8GB
SpeedDDR4 3200 (PC4 25600)
ECCNo
Buffered/RegisteredUnbuffered
ChipsetMajor OEM Samsung, Micron, Hynix
Voltage1.20V
Compatible SystemSamsung
CAS LatencyCL22
Heat SpreaderNo
Type260-Pin DDR4 SODIMM
Rank1Rx8
FeaturesDDR4 Non-ECC Unbuffered SODIMM Motherboard Compatible
Package Content8GB (1X8GB) DDR4 3200MHZ PC4-25600 1Rx8 1.2V CL22 260-PIN Non-ECC Unbuffered SODIMM

Pytania dotyczące tego produktu

How do I install the 260-pin SODIMM and what step do people get wrong?

Power off the laptop, remove the battery if accessible, open the memory door, align the notch on the 260-pin DDR4 SODIMM with the slot key, insert at an angle then press down until both side clips click — the step most people miss is not pressing firmly enough to fully seat the module.

Will the Samsung-compatible 1Rx8 module need any firmware updates or component replacements later?

No firmware updates are required for this 1Rx8 DDR4 3200 CL22 module and it has no heat spreader or moving parts to replace; the only future action is adding another 8 GB stick if the system has a second slot.

What limit appears first when the CL22 1.20 V module runs sustained workloads?

The CAS latency of 22 cycles at 3200 MT/s sets the response-time floor, so under continuous load the latency ceiling is reached before the 1.20 V power envelope or thermal limits become a factor.

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