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Prolimatech

Prolimatech PRO-PK1-1.5G thermal paste 1.5 g

SKU CH-4XFE-6EG13 MPN PRO-PK1-1.5G

High-conductivity 10.2 W/m-K thermal compound with low dry-out for stable CPU or GPU cooling

  • SpecificationsMaterial Specification: Al 60~85(wt%) ZnO 15~25(wt%) Oil 12~
  • FeaturesExcellent long-term stability Not electrically conductive No
  • Low thermal impedance of 0.017 °C·in²/W improves heat transfer
  • Thermal conductivity of 10.2 W/m·K draws heat away efficiently
  • Non-electrically conductive formula prevents short circuits
  • Non-corrosive composition protects metal surfaces over time
  • Low dry-out characteristic maintains performance for longer

Thermal paste for CPU and GPU cooling

Prolimatech PRO-PK1-1.5G is a 1.5 g syringe of thermal compound built for desktop processors and graphics cards. The mixture uses aluminium and zinc oxide in an oil carrier with an antioxidant. It is non-electrically conductive and non-corrosive, making it safe for direct-die and heat-spreader applications.

Replaces dried or stock paste when temperatures

Swapping aged compound for this formula cuts thermal impedance to 0.017 degrees -in2/W and raises conductivity to 10.2 W/m - degrees. The jump is worth it when a cooler runs louder than expected or when a fresh build needs reliable contact without a burn-in period.

Check syringe volume and mounting pressure before

The 1.5 g fill covers several standard CPU installations but may fall short for large cold plates or multiple GPUs. Ensure the cooler applies even pressure so the 310000 Cps viscosity spreads thin without gaps, and confirm the surface is clean of old residue.

Najważniejsze cechy

  • Low thermal impedance of 0.017 °C·in²/W improves heat transfer
  • Thermal conductivity of 10.2 W/m·K draws heat away efficiently
  • Non-electrically conductive formula prevents short circuits
  • Non-corrosive composition protects metal surfaces over time
  • Low dry-out characteristic maintains performance for longer

Specyfikacja

BrandProlimatech
ModelPRO-PK1-1.5G
SpecificationsMaterial Specification: Al 60~85(wt%)
ZnO 15~25(wt%)
Oil 12~20(wt%)
Antioxidant 0.5~2(wt%)
Adhesiveness: 310000Cps
Thermal Conductivity:10.2 W/m - degrees
Thermal Impedance: 0.017 degrees -in2/W
Included: One syringe of thermal compound and one easy-to-spread card.
Specific Gravity: 3.2g/cubic centimeter
FeaturesExcellent long-term stability
Not electrically conductive
Non-corrosive
Easy to apply and less to use
No "burn-in" time required
Low dry-out
Waga przesyłki0.03 kg
Wymiary opakowania102 × 20 × 10 mm

Pytania dotyczące tego produktu

How much thermal paste does the 1.5 g syringe provide for a typical CPU application?

The 1.5 g syringe contains enough compound for multiple CPU applications, with the manufacturer noting that less product is needed per use.

Does the compound require a curing period before it reaches full thermal conductivity of 10.2 W/m-K?

No burn-in time is required; the paste delivers its rated 10.2 W/m-K thermal conductivity immediately after application.

Will the aluminium and zinc oxide particles in the compound cause electrical shorts if they bridge adjacent pins?

The compound is not electrically conductive, so the Al and ZnO filler particles will not create short circuits between pins.

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