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Green E-ATX server motherboard with dual LGA 3647 sockets, sixteen DIMM slots, six PCIe slots and dual RJ45 LAN ports

Supermicro

Supermicro MBD-X11DPI-N-O Dual LGA 3647 DDR4 C621 Server Motherboard

SKU CH-GCG4-3CV0W MPN MBD-X11DPI-N-O

Dual LGA 3647 server motherboard with Intel C621 chipset, 16 DDR4 DIMM slots, 14 SATA3 ports, four PCI-E 3.0 x16 and two x8 slots, M.2 PCI-E 3.0 x4, dual GbE LAN and Aspeed AST2500 BMC

  • CPU Socket TypeDual LGA 3647
  • CPU TypeSupports 2nd Gen Intel Xeon Scalable Processors and Intel Xe
  • North BridgeIntel C621
  • DDR4 StandardDDR4 2666 / 2400 / 2133 MHz ECC RDIMM, LRDIMM
  • Maximum Memory SupportedUp to 2TB 3DS ECC RDIMM and DDR4-2666 MHz, Up to 2TB 3DS ECC
  • PCI Express 3.0 x164
  • Dual LGA 3647 sockets support two Xeon Scalable processors up to 205 W TDP
  • 16 DDR4 DIMM slots deliver up to 2 TB ECC RDIMM or LRDIMM capacity
  • Intel C621 chipset provides 14 SATA3 ports with RAID 0, 1, 5, 10
  • Four PCI-E 3.0 x16 and two PCI-E 3.0 x8 slots enable high-density expansion
  • Dual 1 GbE LAN ports with Marvell 88E1512 plus Aspeed AST2500 BMC for remote management

Dual LGA 3647 server platform

This E-ATX motherboard supports two 1st or 2nd generation Intel Xeon Scalable processors in LGA 3647 sockets with up to 205 W TDP each. It targets system integrators building high-density compute nodes, virtualisation hosts or storage appliances that require dual-socket performance and large memory capacity. The Intel C621 chipset provides the I/O foundation for demanding server workloads.

Sixteen DDR4 slots and six PCI-E lanes

The board offers 16 DIMM slots for DDR4-2666, 2400 or 2133 ECC RDIMM and LRDIMM modules, scaling to 2 TB of 3DS memory. Expansion includes four PCI-E 3.0 x16 slots, two PCI-E 3.0 x8 slots and an M.2 connector supporting 2260, 2280 and 22110 form factors over PCI-E 3.0 x4. Fourteen SATA3 ports with RAID 0, 1, 5, 10 and dual 1 GbE LAN ports handle storage and networking without add-in cards.

Replaces single-socket or older dual-socket boards

Builders moving from single-socket platforms gain a second CPU, doubled memory channels and extra PCI-E bandwidth for GPU or NVMe density. The jump is worthwhile when workloads exceed single-socket core counts, memory limits or I/O lanes. It is not suited for builds that need 10 GbE, onboard NVMe RAID without VROC, or consumer desktop features such as audio or Wi-Fi.

Najważniejsze cechy

  • Dual LGA 3647 sockets support two Xeon Scalable processors up to 205 W TDP
  • 16 DDR4 DIMM slots deliver up to 2 TB ECC RDIMM or LRDIMM capacity
  • Intel C621 chipset provides 14 SATA3 ports with RAID 0, 1, 5, 10
  • Four PCI-E 3.0 x16 and two PCI-E 3.0 x8 slots enable high-density expansion
  • Dual 1 GbE LAN ports with Marvell 88E1512 plus Aspeed AST2500 BMC for remote management

Specyfikacja

BrandSUPERMICRO
ModelMBD-X11DPI-N-O
CPU Socket TypeDual LGA 3647
CPU TypeSupports 2nd Gen Intel Xeon Scalable Processors and Intel Xeon Scalable Processors
North BridgeIntel C621
DDR4 StandardDDR4 2666 / 2400 / 2133 MHz ECC RDIMM, LRDIMM
Maximum Memory SupportedUp to 2TB 3DS ECC RDIMM and DDR4-2666 MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
PCI Express 3.0 x164
PCI Express x82 x PCI Express x8
Other SlotsM.2 Interface: PCI-E 3.0 x4
Form Factor: 2260, 2280, 22110
SATA14 x SATA3 (6 Gbps) port
SATA RAID0/1/5/10
Onboard Video ChipsetAspeed AST2500 BMC
Number of LANDual LAN with GbE from C621
LAN Speed10/100/1000Mbps
Second LAN Speed10/100/1000Mbps
Video Ports1 x VGA port
RJ452 x RJ45
USB 1.1/2.02 x USB 2.0
USB 3.02 x USB 3.0
FeaturesIntel Xeon Scalable Processors, Dual Socket P (LGA 3647) supported, CPU TDP support 205W, 2 UPI up to 10.4 GT/s, CPU1: Skylake-F CPU supported
Intel C621
Up to 2TB 3DS ECC RDIMM and DDR4-2666 MHz, Up to 2TB 3DS ECC LRDIMM, in 16 DIMM slots
4 x PCI-E 3.0 x16, 2 x PCI-E 3.0 x8, M.2 Interface: PCI-E 3.0 x4, M.2 Form Factor: 2260, 2280, 22110, 2 x PCI-E 3.0 NVMExpress x4 Internal Port(s)
1 x VGA port
Intel C621 controller for 14 x SATA3 (6 Gbps) ports; RAID 0, 1, 5, 10
Dual LAN with GbE from C621
Form FactorExtended ATX
Dimensions (W x L)12.0" x 13.0"
Waga przesyłki2.03 kg
Wymiary opakowania429 × 335 × 86 mm

Pytania dotyczące tego produktu

What is the maximum CPU TDP the board can handle before thermal throttling becomes the first bottleneck?

Each socket supports processors up to 205 W TDP, so sustained full-load operation is limited by the cooling solution you provide for that power envelope.

How loud or hot does the onboard dual 1 GbE controller run during continuous all-day traffic?

The Marvell 88E1512 PHYs draw minimal power and generate little heat; they add no audible noise and do not raise board temperature noticeably under constant network load.

Which specific Xeon Scalable processors must I already own for this LGA 3647 board to post and run?

The board requires 1st or 2nd Generation Intel Xeon Scalable CPUs (Socket P) with up to 10.4 GT/s UPI; without a matched pair the system will not boot.

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