Akceptujemy kryptowaluty — posiadane środki można więc wykorzystać na zakup prawdziwego sprzętu.Płatność kryptowalutą — realny sprzęt w zamian. Bezpłatna, ubezpieczona dostawa na całym świecie powyżej 399 $. Neutralne kartony, bez oznaczeń, wysyłane z Niemiec.Bezpłatna, ubezpieczona dostawa powyżej 399 $. Kurs zostaje zablokowany na 30 minut od otwarcia kasy.Kurs zablokowany na 30 minut. Każdy produkt jest fabrycznie zapieczętowany, jego numer seryjny jest sprawdzany, a całość objęta jest 24-miesięczną gwarancją.Zapieczętowane fabrycznie, 24 miesiące gwarancji.

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Thermal Grizzly

Thermal Grizzly Minus Pad 8 100x100x0.5mm thermal pad

SKU CH-RC2Z-WV6WS

High-performance 100x100mm thermal pad with .5mm thickness and ultra-high conductivity for CPUs, GPUs and RAM

  • High thermal conductivity from ceramic silicon and nano aluminum oxide formula
  • Flexible 0.5mm thickness conforms to uneven surfaces for optimal contact
  • 100x100mm size covers large components like GPUs and VRM heatsinks
  • Easy installation with light pressure — no spreading or curing required
  • Electrically insulating silicone compound safe for direct component contact

Thermal pad 100x100x0.5mm

The Thermal Grizzly Minus Pad 8 is a single thermal pad measuring 100mm by 100mm with a 0.5mm thickness. It uses a ceramic silicon formula complex with nano aluminium oxide to deliver ultra-high thermal conductivity. The highly elastic and flexible material compensates for small gaps between components. A light touch is enough to secure optimal attachment.

Suits DIY repairs on RAM, CPUs.

Builders who need to bridge uneven surfaces on memory modules, graphics cards or laptop heatspreaders will benefit from the conformable silicone pad. It is not for buyers who require multiple pads in one pack or those who need a different sheet size or thickness. The product is sold as a single piece only.

0.5mm thickness decides the fit

The 0.5mm dimension determines whether the pad correctly fills the specific gap between your component and its heatsink. A thicker or thinner pad would change the contact pressure and thermal performance. Verify the exact clearance required by your hardware before purchasing.

Najważniejsze cechy

  • High thermal conductivity from ceramic silicon and nano aluminum oxide formula
  • Flexible 0.5mm thickness conforms to uneven surfaces for optimal contact
  • 100x100mm size covers large components like GPUs and VRM heatsinks
  • Easy installation with light pressure — no spreading or curing required
  • Electrically insulating silicone compound safe for direct component contact

Specyfikacja

Na razie brak opublikowanej specyfikacji tego produktu.

Pytania dotyczące tego produktu

What component spacing does the 0.5mm pad thickness suit?

The 0.5mm pad fills gaps up to half a millimetre between a chip and its cooler, so it works where the original thermal interface was similarly thin.

Can I stack this pad with a thicker one to replace a 1mm gap on an older graphics card?

Stacking pads adds air pockets and reduces conductivity; choose the single thickness that matches the gap instead.

How can I confirm the pad is making full contact after installation?

After mounting the heatscrew, the pad should appear evenly compressed across the 100mm x 100mm surface with no visible gaps or wrinkles.

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Ten sam dział, ta sama kasa — osiem kryptowalut i 30-minutowa blokada kursu.