Thermal Grizzly Minus Pad 8 30x30x2.0mm thermal pad

Single 30 mm thermal pad for component cooling

The Thermal Grizzly Minus Pad 8 is a single high-performance thermal pad measuring 30 mm by 30 mm with a 2.0 mm thickness. It is designed to transfer heat from CPUs, GPUs, memory modules and other compatible components. The pad uses a ceramic silicon formula complex with nano aluminium oxide to achieve ultra-high thermal conductivity. It suits builders who need a precisely sized interface for specific chip or heatsink contact.

Ceramic silicon compound sets conductivity ceiling

Heat transfer depends on the pad’s ceramic silicon formula complex and nano aluminium oxide construction rather than metal or liquid metal alternatives. The material remains electrically non-conductive, avoiding short-circuit risk if it spreads beyond the die. Thickness is fixed at 2.0 mm, so the pad cannot compensate for larger gaps or uneven mounting pressure beyond its elastic limit. Users requiring higher conductivity or different thicknesses must select a different product.

Flexible pad simplifies placement but demands

The highly elastic and flexible surface allows the pad to conform with only light pressure, making installation straightforward on flat component surfaces. Each package contains exactly one 30 mm square pad, so multiple components require additional units. Residue from old thermal material must be removed completely; any contamination reduces the pad’s ability to maintain optimal contact. The pad is eco-friendly and RoHS-compliant.