Thermal Hero
Thermal Hero NEO thermal paste 10 g
Silicone-based thermal compound delivers high conductivity and low resistance for stable CPU and GPU cooling across PCs and consoles
- High thermal conductivity for exceptional heat dissipation
- Low thermal resistance delivers strong cooling performance even at low contact pressure
- Non-electrically conductive and non-toxic for safe use on any component
- Low viscosity and high flow properties make application easy on CPU, GPU or consoles
- Does not dry out, harden or separate, maintaining stability over time
Thermal Hero NEO 10 g thermal paste
Thermal Hero NEO is a silicone-based thermal compound designed for high thermal conductivity and low thermal resistance. It suits overclockers, gamers and anyone upgrading CPU, GPU or console cooling. The paste is non-toxic, non-electrically conductive and compliant with ROHS and REACH standards. It resists drying, hardening or separating over time.
Before applying check surface compatibility
Ensure the heatsink or cold plate is clean and free of old compound residue before ordering. The paste works with any processor, graphics card or IC that accepts standard thermal interface material. No special tools or curing steps are required for installation. Verify that your component mounting pressure is within normal limits for paste application.
Fits any standard CPU GPU or console build
The low-viscosity formula spreads easily under light pressure and stays in place without migrating. It fills microscopic gaps between die and cooler for efficient heat transfer in desktops, laptops and consoles. The 10 g syringe provides enough material for multiple applications across different devices. It frees you from worrying about pump-out or degradation during long-term high-temperature operation.
Najważniejsze cechy
- High thermal conductivity for exceptional heat dissipation
- Low thermal resistance delivers strong cooling performance even at low contact pressure
- Non-electrically conductive and non-toxic for safe use on any component
- Low viscosity and high flow properties make application easy on CPU, GPU or consoles
- Does not dry out, harden or separate, maintaining stability over time
Specyfikacja
Na razie brak opublikowanej specyfikacji tego produktu.
Pytania dotyczące tego produktu
What comes inside the 10 g package and is any extra tool needed?
The package contains 10 g of silicone-based thermal paste. No separate tools are required; the paste can be applied directly from the syringe onto any CPU, GPU or console chip.
Which capacity should I pick for a typical CPU or GPU application?
The 10 g syringe covers multiple applications on standard processors and graphics cards, making it suitable for both single builds and repeat use.
How does the stated high thermal conductivity and low viscosity translate to real cooling performance?
The low viscosity lets the paste spread thinly under light mounting pressure, filling microscopic gaps so heat moves efficiently from the die to the cooler without the compound pumping out over time.
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