UPSIREN OEM Thermal Pad 16W/mK 100x100x1.5mm 23g

Thermal pad for component gaps

This UPSIREN OEM pad measures 100 by 100 millimetres with a 1.5 millimetre thickness and weighs 23 grams. It provides a thermal conductivity of 16 watts per metre kelvin to transfer heat between chips and heatsinks. The silicone material stays flexible across a range of minus 40 to 200 degrees Celsius. It is non-conductive, non-corrosive and non-curing for safe long-term use.

Practical limits of a silicone pad

A pad of this thickness fills gaps up to 1.5 millimetres but cannot bridge larger spaces without stacking. Thermal resistance rises if the contact pressure is too low, so the mounting must press the surfaces together firmly. The material softens at 30 degrees Shore hardness to conform to uneven surfaces, yet it will not flow or pump out like a grease. Repositioning is possible because the pad does not cure or bond permanently.

Build quality and daily handling

The silicone sheet resists tearing during installation and survives repeated assembly cycles without losing performance. Its non-conductive nature prevents short circuits if it touches exposed traces or component leads. The pad is odourless, non-toxic and fire-retardant, making it suitable for enclosed electronics. Natural viscosity keeps it in place once seated, while the 100 millimetre square can be trimmed for smaller dies or voltage-regulator modules.