UPSIREN
UPSIREN OEM Thermal Pad 16W/mK 100x100x1.5mm 23g
A 16 W/mK silicone thermal pad measuring 100 x 100 x 1.5 mm, non-conductive and rated from -40 to 200 °C for CPU, GPU or LED heatsinks
- Volume / Net Weight23g
- Thermal Conductivity16W/mk
- Long Term Operating Temperature-40 to 200 C
- FeaturesNon-Corrosive, Non-Curing & Non-Toxi
Option 100 x 100 x 1.5 mm
- 100 x 100 x 3.0 mm
- 100 x 100 x 0.5 mm
- 100 x 100 x 2.0 mm
- 100 x 100 x 1.5 mm
- 100 x 100 x 1.0 mm
- 100*100*2.5mm
- High thermal conductivity at 16 W/mK for efficient heat transfer
- Soft 30-degree hardness compresses to fill gaps between chip and heatsink
- Non-conductive silicone insulates electrically while conducting heat safely
- Operates reliably from -40 °C to 200 °C without melting
- Reusable pad with natural viscosity simplifies installation and maintenance
Thermal pad for component gaps
This UPSIREN OEM pad measures 100 by 100 millimetres with a 1.5 millimetre thickness and weighs 23 grams. It provides a thermal conductivity of 16 watts per metre kelvin to transfer heat between chips and heatsinks. The silicone material stays flexible across a range of minus 40 to 200 degrees Celsius. It is non-conductive, non-corrosive and non-curing for safe long-term use.
Practical limits of a silicone pad
A pad of this thickness fills gaps up to 1.5 millimetres but cannot bridge larger spaces without stacking. Thermal resistance rises if the contact pressure is too low, so the mounting must press the surfaces together firmly. The material softens at 30 degrees Shore hardness to conform to uneven surfaces, yet it will not flow or pump out like a grease. Repositioning is possible because the pad does not cure or bond permanently.
Build quality and daily handling
The silicone sheet resists tearing during installation and survives repeated assembly cycles without losing performance. Its non-conductive nature prevents short circuits if it touches exposed traces or component leads. The pad is odourless, non-toxic and fire-retardant, making it suitable for enclosed electronics. Natural viscosity keeps it in place once seated, while the 100 millimetre square can be trimmed for smaller dies or voltage-regulator modules.
Najważniejsze cechy
- High thermal conductivity at 16 W/mK for efficient heat transfer
- Soft 30-degree hardness compresses to fill gaps between chip and heatsink
- Non-conductive silicone insulates electrically while conducting heat safely
- Operates reliably from -40 °C to 200 °C without melting
- Reusable pad with natural viscosity simplifies installation and maintenance
Specyfikacja
| Brand | UPSIREN |
|---|---|
| Series | OEM |
| Model | 16W |
| Volume / Net Weight | 23g |
| Thermal Conductivity | 16W/mk |
| Long Term Operating Temperature | -40 to 200 C |
| Features | Non-Corrosive, Non-Curing & Non-Toxi |
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Pytania dotyczące tego produktu
Should I pick the 1.5 mm thickness or a different one?
This pad is 1.5 mm thick; choose it when the gap between your chip and heatsink measures about that after compression.
What does 16 W/mK mean for my GPU temperatures?
It indicates high conductivity for a silicone pad, so heat moves from the die to the heatsink more efficiently than with standard pads.
Is the pad electrically conductive?
No, it is non-conductive and insulated, so it will not short components if it touches nearby circuitry.
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