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UPSIREN

UPSIREN OEM 16W/mK Thermal Pad 100x100x1.0mm 23g

SKU CH-N0JE-ZAX4A

A 100 x 100 x 1.0 mm silicone thermal pad rated at 16 W/mK conductivity, non-conductive and reusable for CPU, GPU or LED heatsink gaps

  • Volume / Net Weight23g
  • Thermal Conductivity16W/mk
  • Long Term Operating Temperature-40 to 200 C
  • FeaturesNon-Corrosive, Non-Curing & Non-Toxi
  • High 16 W/mK conductivity moves heat fast
  • 0 mm thickness fits tight gaps
  • Non-conductive silicone prevents short circuits
  • Soft 30 Shore pad conforms to surfaces
  • Operates from -40 °C to 200 °C

Thermal pad for CPU GPU and LED cooling

The UPSIREN OEM thermal pad measures 100 by 100 millimetres with a 1.0 millimetre thickness and weighs 23 grams. It is designed to fill gaps between chips and heatsinks in laptops, graphics cards, processors and LED coolers. The silicone material is non-conductive and non-corrosive, making it safe for direct contact with electronic components.

Operating range and thermal performance

Rated at 16 W/mK thermal conductivity, the pad transfers heat efficiently across its surface. It remains stable from minus 40 to 200 degrees Celsius without melting or curing. The 30-degree Shore hardness keeps the pad soft and compressible so it conforms tightly to uneven surfaces under normal mounting pressure.

Build quality and daily handling

The pad is non-toxic, odourless and fire-retardant while resisting wear, compression set and static buildup. Its natural viscosity allows easy placement and reuse during maintenance without leaving residue on metal parts. Insulation properties prevent electrical shorts, so the single piece can be trimmed and fitted in various industrial, automotive and consumer electronics applications.

Najważniejsze cechy

  • High 16 W/mK conductivity moves heat fast
  • 0 mm thickness fits tight gaps
  • Non-conductive silicone prevents short circuits
  • Soft 30 Shore pad conforms to surfaces
  • Operates from -40 °C to 200 °C

Specyfikacja

BrandUPSIREN
SeriesOEM
Model16W
Volume / Net Weight23g
Thermal Conductivity16W/mk
Long Term Operating Temperature-40 to 200 C
FeaturesNon-Corrosive, Non-Curing & Non-Toxi

Inne wersje tego modelu

Jeszcze 5 w tej samej serii

Ta sama rodzina, inna pamięć, inne chłodzenie lub taktowanie — proszę porównać przed decyzją.

Pytania dotyczące tego produktu

How do I install the 1.0 mm thick UPSIREN thermal pad and what step often goes wrong?

Cut the 100 x 100 mm sheet to size, peel the protective film from both faces, place it between the chip and heatsink, then torque the mounting screws evenly; the common error is leaving one liner on, which blocks heat flow.

Will the 16 W/mK pad need replacement and when?

The silicone is non-curing and rated for -40 to 200 °C long-term, so it does not dry out; replace only if the pad is torn, contaminated, or the assembly is disassembled for another reason.

What limit appears first during sustained heavy load?

The 1.0 mm thickness and 30-degree hardness set the minimum gap the pad can fill; if the mating surfaces exceed that gap or pressure deforms the pad beyond its recovery, thermal resistance rises before the 200 °C temperature ceiling is reached.

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