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Six green 288-pin DDR5 RDIMM modules without heat spreaders

NEMIX RAM

NEMIX RAM DDR5 576GB (6x96GB) 6400MHz CL52 ECC RDIMM GIGABYTE MZ73-LM2 memory upgrade

SKU CH-T59N-VPXN8

A 576GB server memory kit of six 96GB DDR5 6400MHz CL52 ECC registered RDIMMs at 1.1V, validated for the GIGABYTE MZ73-LM2 motherboard

  • Capacity576GB (6 x 96GB)
  • Type288-Pin DDR5 RDIMM
  • SpeedDDR5 6400 (PC5 51200)
  • CAS LatencyCL52
  • Voltage1.10V
  • ECCYes

Size 576GB 6X96GB

Zobrazit dalších 24 konfigurací
  • 576 GB total capacity from six 96 GB modules for maximum server memory density
  • DDR5 6400 speed with CL52 latency delivers rated bandwidth for demanding workloads
  • Registered ECC architecture corrects single-bit errors and stabilises fully populated slots
  • 1 V operation matches the motherboard's memory-controller specification exactly
  • 288-pin RDIMM form factor fits the GIGABYTE MZ73-LM2 without adapters

Exact-fit 576 GB server kit

This NEMIX RAM kit delivers 576 GB as six 96 GB DDR5 6400 RDIMMs tuned to CL52 at 1.1 V. Registered ECC and 2Rx4 organisation match the GIGABYTE MZ73-LM2 memory controller so every slot is recognised at full capacity and rated speed. It is built for administrators who need maximum registered capacity on this specific platform.

Thermals power and noise

Modules run at the standard 1.1 V DDR5 voltage with no heat spreader, relying on chassis airflow for cooling. Registered buffering reduces electrical load on the memory controller when all six slots are populated. No moving parts are present so the kit adds no acoustic output.

Build quality and daily use

Each 288-pin RDIMM uses major OEM Samsung Micron Hynix die and omits a heat spreader to fit dense server layouts. The registered ECC design corrects single-bit errors on the fly preventing silent data corruption in production workloads. Verify the motherboard manual for supported population order before installation.

Přednosti

  • 576 GB total capacity from six 96 GB modules for maximum server memory density
  • DDR5 6400 speed with CL52 latency delivers rated bandwidth for demanding workloads
  • Registered ECC architecture corrects single-bit errors and stabilises fully populated slots
  • 1 V operation matches the motherboard's memory-controller specification exactly
  • 288-pin RDIMM form factor fits the GIGABYTE MZ73-LM2 without adapters

Specifikace

BrandNEMIX RAM
SeriesNEMIX RAM Original Series Server Memory
ModelDDR5 ECC RDIMM Registered Server Memory
Part NumberMR51200-9624K6
Capacity576GB (6 x 96GB)
Type288-Pin DDR5 RDIMM
SpeedDDR5 6400 (PC5 51200)
CAS LatencyCL52
Voltage1.10V
ECCYes
Buffered/RegisteredRegistered
Rank2Rx4
ChipsetMajor OEM Samsung, Micron, Hynix
Heat SpreaderNo
Compatible SystemGIGABYTE
FeaturesDDR5 ECC RDIMM Motherboard Compatible
Package Content576GB 6X96GB DDR5 6400MHz PC5-51200 2Rx4 1.1V 288-PIN ECC RDIMM KIT

Další verze tohoto modelu

Dalších 5 v této řadě

Stejná řada, jiná paměť, chladič nebo takt — porovnejte, než se rozhodnete.

Otázky k tomuto produktu

How do I install the 288-pin RDIMM kit into the GIGABYTE MZ73-LM2 and which population order should I follow?

Power down the server, open the chassis, and insert each 96GB module into the DIMM slots following the exact population sequence shown in the MZ73-LM2 manual; the 2Rx4 registered design requires the correct slot order so the memory controller recognises the full 576GB at DDR5 6400.

Will the ECC RDIMM modules need any firmware updates or periodic re-seating during their service life?

No firmware updates are required for the memory itself; the Samsung, Micron or Hynix DRAM chips and the registered buffer are sealed components, so only standard server dust cleaning and visual inspection of the 288-pin contacts are needed over time.

What thermal or electrical limit appears first when all six 96GB DIMMs run continuously at 6400 MT/s?

The 1.10 V operating voltage and CL52 latency are fixed by the DDR5 6400 specification; sustained full-load operation stays within the JEDEC-defined thermal and signal-integrity envelope for 2Rx4 registered modules, so no lower limit is reached before the platform's own cooling capacity.

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