NEMIX RAM 512GB 4x128GB DDR5 5600 CL46 ECC RDIMM Supermicro H13SST-G memory upgrade
- 512GB (4 x 128GB)
- 288-Pin DDR5 RDIMM
NEMIX RAM
A 576GB server memory kit of six 96GB DDR5 6400MHz CL52 ECC registered RDIMMs at 1.1V, validated for the GIGABYTE MZ73-LM2 motherboard
Size 576GB 6X96GB
This NEMIX RAM kit delivers 576 GB as six 96 GB DDR5 6400 RDIMMs tuned to CL52 at 1.1 V. Registered ECC and 2Rx4 organisation match the GIGABYTE MZ73-LM2 memory controller so every slot is recognised at full capacity and rated speed. It is built for administrators who need maximum registered capacity on this specific platform.
Modules run at the standard 1.1 V DDR5 voltage with no heat spreader, relying on chassis airflow for cooling. Registered buffering reduces electrical load on the memory controller when all six slots are populated. No moving parts are present so the kit adds no acoustic output.
Each 288-pin RDIMM uses major OEM Samsung Micron Hynix die and omits a heat spreader to fit dense server layouts. The registered ECC design corrects single-bit errors on the fly preventing silent data corruption in production workloads. Verify the motherboard manual for supported population order before installation.
| Brand | NEMIX RAM |
|---|---|
| Series | NEMIX RAM Original Series Server Memory |
| Model | DDR5 ECC RDIMM Registered Server Memory |
| Part Number | MR51200-9624K6 |
| Capacity | 576GB (6 x 96GB) |
| Type | 288-Pin DDR5 RDIMM |
| Speed | DDR5 6400 (PC5 51200) |
| CAS Latency | CL52 |
| Voltage | 1.10V |
| ECC | Yes |
| Buffered/Registered | Registered |
| Rank | 2Rx4 |
| Chipset | Major OEM Samsung, Micron, Hynix |
| Heat Spreader | No |
| Compatible System | GIGABYTE |
| Features | DDR5 ECC RDIMM Motherboard Compatible |
| Package Content | 576GB 6X96GB DDR5 6400MHz PC5-51200 2Rx4 1.1V 288-PIN ECC RDIMM KIT |
其他版本
同系列產品,記憶體、散熱器或時脈不同 — 下單前請先比較。
Power down the server, open the chassis, and insert each 96GB module into the DIMM slots following the exact population sequence shown in the MZ73-LM2 manual; the 2Rx4 registered design requires the correct slot order so the memory controller recognises the full 576GB at DDR5 6400.
No firmware updates are required for the memory itself; the Samsung, Micron or Hynix DRAM chips and the registered buffer are sealed components, so only standard server dust cleaning and visual inspection of the 288-pin contacts are needed over time.
The 1.10 V operating voltage and CL52 latency are fixed by the DDR5 6400 specification; sustained full-load operation stays within the JEDEC-defined thermal and signal-integrity envelope for 2Rx4 registered modules, so no lower limit is reached before the platform's own cooling capacity.
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