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Sledované položky Přihlásit se
Four silver server memory modules with black heat spreaders and gold contacts

Team Group

Team Group CTCMD564G6000HC32AQC01 64GB (4×16GB) DDR5 6000 CL32 ECC RDIMM server RAM

SKU CH-2CAQ-NQNN8 MPN CTCMD564G6000HC32AQC01

64 GB quad-channel DDR5 RDIMM kit with ECC, CL32 latency and XMP 3.0 or EXPO profiles

  • Capacity64GB (4 x 16GB)
  • Type288-Pin DDR5 RDIMM
  • SpeedDDR5 6000 (PC5 48000)
  • CAS LatencyCL32
  • Timing32-39-39-84
  • Voltage1.40V

Capacity

  • 128GB (4 x 32GB)
  • 128GB (8 x 16GB)
  • 192GB (4 x 48GB)
  • 192GB (8 x 24GB)
  • 256GB (8 x 32GB)
  • 384GB (8 x 48GB)
  • 64GB (4 x 16GB)
  • 96GB (4 x 24GB)

Přeškrtnuté varianty existují, ale zde nejsou skladem.

Speed DDR5 6000 (PC5 48000)

  • 64 GB quad-channel capacity scales multi-threaded workloads
  • ECC registered design corrects data errors for stable operation
  • DDR5 6000 CL32 timing delivers high bandwidth at low latency
  • Intel XMP 3.0 and AMD EXPO profiles enable one-click overclocking
  • Patented IC verification ensures consistent reliability across modules

Capacity and platform fit

This 64 GB kit ships as four 16 GB DDR5 RDIMMs rated for 6000 MT/s at CL32 with a 1.40 V operating voltage. Registered design and on-die ECC target workstation and server platforms built around Intel W790 or W890 chipsets and AMD TRX50 or WRX90 platforms. Buyers who need unbuffered UDIMMs or consumer SO-DIMM form factors cannot use these modules.

Thermals and power profile

Professional heat spreaders cover each module to manage the thermal load of 1.40 V operation during sustained workloads. Registered buffering adds a clock cycle of latency but reduces electrical loading on the memory controller, helping stability at the rated 6000 MT/s speed. The kit draws more power than standard 1.1 V JEDEC parts, so adequate case airflow is required.

Overclocking profiles and validation

Intel XMP 3.0 and AMD EXPO profiles store the 6000 MT/s CL32 32-39-39-84 timing set for one-click configuration on supported motherboards. Team Group’s patented IC classification (Taiwan I751093, US 11488679) validates each Hynix die before assembly, reducing early-life failures. Systems without XMP 3.0 or EXPO support must be tuned manually in firmware.

Přednosti

  • 64 GB quad-channel capacity scales multi-threaded workloads
  • ECC registered design corrects data errors for stable operation
  • DDR5 6000 CL32 timing delivers high bandwidth at low latency
  • Intel XMP 3.0 and AMD EXPO profiles enable one-click overclocking
  • Patented IC verification ensures consistent reliability across modules

Specifikace

BrandTeam
SeriesT-Create Master
ModelCTCMD564G6000HC32AQC01
Part NumberCTCMD564G6000HC32AQC01
Capacity64GB (4 x 16GB)
Type288-Pin DDR5 RDIMM
SpeedDDR5 6000 (PC5 48000)
CAS LatencyCL32
Timing32-39-39-84
Voltage1.40V
ECCYes
Buffered/RegisteredRegistered
Multi-channel KitQuad Channel Kit
BIOS/Performance ProfileIntel XMP 3.0 and AMD EXPO
ChipsetAMD TRX50/WRX90
Intel W790/W890
FeaturesDefies all you know about R-DIMM memory
Professionally designed with low-key aesthetics
Error-correction code (ECC) allows for a more focused creation
Professional and highly-effective heat dissipation ability
Lifetime warranty guarantees every creation
Patented IC classification and verification technology, ensuring applicability and durability
Přepravní hmotnost0.13 kg
Rozměry balení160 × 115 × 15 mm

Další verze tohoto modelu

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Otázky k tomuto produktu

How do I install this 288-pin DDR5 RDIMM kit and enable the XMP 3.0 profile?

Insert all four 16 GB modules into the correct quad-channel slots, then enter the BIOS and enable the Intel XMP 3.0 or AMD EXPO profile to run at 6000 MT/s with 1.40 V.

Will the heatspreader or ECC function need any maintenance or replacement over time?

The aluminium heatspreader is passive and requires no service; the on-die ECC logic is built into each Hynix IC and lasts for the module's lifetime without user intervention.

At what point does the 1.40 V operating voltage become a thermal limit during sustained loads?

The patented IC sorting and the high-efficiency heatspreader are designed to keep the modules within specification at 1.40 V during continuous 6000 MT/s operation.

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