Team Group CTCMD564G6400HC32AQC01 64GB (4×16GB) DDR5 6400 CL32 ECC RDIMM server RAM
- 64GB (4 x 16GB)
- 288-Pin DDR5 RDIMM
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Team Group
64 GB quad-channel DDR5 RDIMM kit with ECC, CL32 latency and XMP 3.0 or EXPO profiles
Capacity
Struck-through versions exist but are not stocked here.
Speed DDR5 6000 (PC5 48000)
This 64 GB kit ships as four 16 GB DDR5 RDIMMs rated for 6000 MT/s at CL32 with a 1.40 V operating voltage. Registered design and on-die ECC target workstation and server platforms built around Intel W790 or W890 chipsets and AMD TRX50 or WRX90 platforms. Buyers who need unbuffered UDIMMs or consumer SO-DIMM form factors cannot use these modules.
Professional heat spreaders cover each module to manage the thermal load of 1.40 V operation during sustained workloads. Registered buffering adds a clock cycle of latency but reduces electrical loading on the memory controller, helping stability at the rated 6000 MT/s speed. The kit draws more power than standard 1.1 V JEDEC parts, so adequate case airflow is required.
Intel XMP 3.0 and AMD EXPO profiles store the 6000 MT/s CL32 32-39-39-84 timing set for one-click configuration on supported motherboards. Team Group’s patented IC classification (Taiwan I751093, US 11488679) validates each Hynix die before assembly, reducing early-life failures. Systems without XMP 3.0 or EXPO support must be tuned manually in firmware.
| Brand | Team |
|---|---|
| Series | T-Create Master |
| Model | CTCMD564G6000HC32AQC01 |
| Part Number | CTCMD564G6000HC32AQC01 |
| Capacity | 64GB (4 x 16GB) |
| Type | 288-Pin DDR5 RDIMM |
| Speed | DDR5 6000 (PC5 48000) |
| CAS Latency | CL32 |
| Timing | 32-39-39-84 |
| Voltage | 1.40V |
| ECC | Yes |
| Buffered/Registered | Registered |
| Multi-channel Kit | Quad Channel Kit |
| BIOS/Performance Profile | Intel XMP 3.0 and AMD EXPO |
| Chipset | AMD TRX50/WRX90 Intel W790/W890 |
| Features | Defies all you know about R-DIMM memory Professionally designed with low-key aesthetics Error-correction code (ECC) allows for a more focused creation Professional and highly-effective heat dissipation ability Lifetime warranty guarantees every creation Patented IC classification and verification technology, ensuring applicability and durability |
| Shipping weight | 0.13 kg |
| Package size | 160 × 115 × 15 mm |
Other versions of this model
Same family, different memory, cooler or clock — compare before you commit.
Insert all four 16 GB modules into the correct quad-channel slots, then enter the BIOS and enable the Intel XMP 3.0 or AMD EXPO profile to run at 6000 MT/s with 1.40 V.
The aluminium heatspreader is passive and requires no service; the on-die ECC logic is built into each Hynix IC and lasts for the module's lifetime without user intervention.
The patented IC sorting and the high-efficiency heatspreader are designed to keep the modules within specification at 1.40 V during continuous 6000 MT/s operation.
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