UPSIREN OEM 21W Thermal Pad 100x100x2.5mm 23g

Thermal pad for CPU, GPU and laptop heatsinks

This 100 x 100 mm silicone pad sits between a heat-generating chip and its cooler, transferring thermal energy with a rated conductivity of 21 W/mK. The material is electrically non-conductive, non-corrosive, non-curing and non-toxic, making it safe for direct contact with exposed circuitry. At 2.5 mm thick it bridges typical gaps found on graphics cards, laptop processors and LED modules. The pad weighs 23 g and is supplied as a single piece.

Sustained heat transfer across a wide temperature

Rated for continuous operation from -40 °C to 200 °C, the pad does not melt, dry out or lose compliance during prolonged loads. Its 30-degree hardness allows it to conform under pressure, maintaining intimate contact with uneven surfaces without pumping out over time. The silicone base resists ageing, so thermal resistance remains stable through repeated heating and cooling cycles typical of gaming or rendering workloads.

Reusable, insulated sheet simplifies installation

Natural surface tack holds the pad in place during assembly yet permits clean removal for rework or upgrades. Because it is non-conductive, there is no risk of shorting adjacent components if the pad extends beyond the die. The material is also fire-retardant, anti-static and resistant to corrosion, supporting long-term reliability in enclosed chassis. Buyers who need a thinner or thicker gap filler, or a pad pre-cut for a specific GPU model, will not find those variants in this listing.