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Square grey silicone thermal pad 100 by 100 by 2.5 mm

UPSIREN

UPSIREN OEM 21W Thermal Pad 100x100x2.5mm 23g

SKU CH-ZTKR-ATV2J

High-conductivity 21 W/mK silicone pad measuring 100×100×2.5 mm transfers heat from CPU, GPU or laptop heatsinks while staying electrically insulating and non-corrosive

  • Volume / Net Weight23g
  • Thermal Conductivity21W/mk
  • Long Term Operating Temperature-40 to 200 C
  • FeaturesNon-Corrosive, Non-Curing & Non-Toxi

Option 100*100*2.5mm

  • 21 W/mK conductivity moves heat fast from CPU or GPU
  • 100 × 100 × 2.5 mm sheet fits many heatsink layouts
  • Non-conductive silicone prevents shorts on dense PCBs
  • Soft 30-degree material compresses for full chip contact
  • Rated –40 °C to 200 °C for long-term stability

Thermal pad for CPU, GPU and laptop heatsinks

This 100 x 100 mm silicone pad sits between a heat-generating chip and its cooler, transferring thermal energy with a rated conductivity of 21 W/mK. The material is electrically non-conductive, non-corrosive, non-curing and non-toxic, making it safe for direct contact with exposed circuitry. At 2.5 mm thick it bridges typical gaps found on graphics cards, laptop processors and LED modules. The pad weighs 23 g and is supplied as a single piece.

Sustained heat transfer across a wide temperature

Rated for continuous operation from -40 °C to 200 °C, the pad does not melt, dry out or lose compliance during prolonged loads. Its 30-degree hardness allows it to conform under pressure, maintaining intimate contact with uneven surfaces without pumping out over time. The silicone base resists ageing, so thermal resistance remains stable through repeated heating and cooling cycles typical of gaming or rendering workloads.

Reusable, insulated sheet simplifies installation

Natural surface tack holds the pad in place during assembly yet permits clean removal for rework or upgrades. Because it is non-conductive, there is no risk of shorting adjacent components if the pad extends beyond the die. The material is also fire-retardant, anti-static and resistant to corrosion, supporting long-term reliability in enclosed chassis. Buyers who need a thinner or thicker gap filler, or a pad pre-cut for a specific GPU model, will not find those variants in this listing.

商品特色

  • 21 W/mK conductivity moves heat fast from CPU or GPU
  • 100 × 100 × 2.5 mm sheet fits many heatsink layouts
  • Non-conductive silicone prevents shorts on dense PCBs
  • Soft 30-degree material compresses for full chip contact
  • Rated –40 °C to 200 °C for long-term stability

商品規格

BrandUPSIREN
SeriesOEM
Model21W
Volume / Net Weight23g
Thermal Conductivity21W/mk
Long Term Operating Temperature-40 to 200 C
FeaturesNon-Corrosive, Non-Curing & Non-Toxi

其他版本

同系列還有 5 款

同系列產品，記憶體、散熱器或時脈不同 — 下單前請先比較。

商品問答

Does the 21 W/mK thermal pad generate extra heat or noise during continuous operation?

The pad is a passive silicone interface with 21 W/mK conductivity; it has no moving parts, draws no power and produces no noise or heat of its own.

What components must already be in place for this 100 × 100 × 2.5 mm pad to work?

A heatsink or cooler with a matching mounting surface and a component such as a CPU, GPU or LED module that needs the gap filled.

Will the 2.5 mm thickness and 30-degree hardness suit older laptop heatsinks that have larger gaps?

The pad is soft and compressible, so it conforms to uneven surfaces and can bridge wider gaps on legacy heatsinks while staying non-conductive.

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