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Square blue silicone thermal pad 100 by 100 by 3.0 mm

UPSIREN

UPSIREN OEM Thermal Pad 18W/mK 100x100x3.0mm 23g

SKU CH-8QWH-HJDKZ

A 100 x 100 x 3.0 mm silicone thermal pad rated at 18 W/mK conductivity, non-conductive and reusable for CPU, GPU or laptop heatsink gaps

  • Volume / Net Weight23g
  • Thermal Conductivity18W/mk
  • Long Term Operating Temperature-40 to 200 C
  • FeaturesNon-Corrosive, Non-Curing & Non-Toxi

Option 100 x 100 x 3.0 mm

  • High 18 W/mK conductivity moves heat fast
  • Soft 30-degree pad compresses to fill gaps
  • Non-conductive silicone keeps circuits safe
  • Withstands -40 °C to 200 °C without melting
  • Reusable 100 × 100 × 3.0 mm sheet cuts to fit

UPSIREN OEM 18 W/mK Thermal Pad

This UPSIREN OEM thermal pad measures 100 x 100 x 3.0 mm and weighs 23 g. It is a soft silicone interface designed to fill gaps between a heat source and a heatsink in laptops, GPUs, CPUs or LED coolers. The material is non-conductive, non-corrosive and non-curing for safe, reusable application.

Sustained load thermal behaviour

Rated at 18 W/mK conductivity, the pad operates continuously from -40 °C to 200 °C without melting or degrading. Its 30-degree hardness lets it compress and maintain close contact with uneven chip surfaces during long sessions. The non-curing compound avoids pump-out so thermal resistance stays stable over time.

Build quality and daily handling

The pad is electrically insulating, anti-static and fire-retardant, protecting sensitive components during installation and service. Natural viscosity holds it in place without adhesive residue, allowing easy removal and repositioning. It resists corrosion, wear and odour, making it suitable for repeated disassembly in workshop or field repairs.

商品特色

  • High 18 W/mK conductivity moves heat fast
  • Soft 30-degree pad compresses to fill gaps
  • Non-conductive silicone keeps circuits safe
  • Withstands -40 °C to 200 °C without melting
  • Reusable 100 × 100 × 3.0 mm sheet cuts to fit

商品規格

BrandUPSIREN
SeriesOEM
Model18W
Volume / Net Weight23g
Thermal Conductivity18W/mk
Long Term Operating Temperature-40 to 200 C
FeaturesNon-Corrosive, Non-Curing & Non-Toxi

其他版本

同系列還有 5 款

同系列產品，記憶體、散熱器或時脈不同 — 下單前請先比較。

商品問答

Does the 18 W/mK pad stay soft enough to maintain contact after months of daily heating cycles?

The pad is rated for long-term operation from -40 to 200 °C and is non-curing, so it will not harden or lose conformity over repeated thermal cycles.

What surface preparation or additional material is needed before applying this 3.0 mm pad?

No extra compound or adhesive is required; the pad has natural viscosity, is reusable, and can be placed directly between the component and heatsink.

Will the 100 x 100 mm size cover the larger dies found on older high-end GPUs and CPUs?

The pad measures 100 x 100 mm and can be cut to fit; its 3.0 mm thickness suits gaps typical of legacy graphics cards and processor packages.

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