UPSIREN
UPSIREN OEM 21W/mK Thermal Pad 100x100x1.5mm 23g
A 100 × 100 × 1.5 mm silicone thermal pad rated at 21 W/mK conductivity, non-conductive and reusable from −40 °C to 200 °C
- Volume / Net Weight23g
- Thermal Conductivity21W/mk
- Long Term Operating Temperature-40 to 200 C
- FeaturesNon-Corrosive, Non-Curing & Non-Toxi
Option 100 x 100 x 1.5 mm
- 100 x 100 x 3.0 mm
- 100 x 100 x 0.5 mm
- 100 x 100 x 2.0 mm
- 100 x 100 x 1.5 mm
- 100 x 100 x 1.0 mm
- 100*100*2.5mm
- 21 W/mK conductivity moves heat fast from chip to heatsink
- Soft 30 Shore pad compresses to fill uneven gaps for full contact
- Non-conductive silicone prevents shorts while insulating sensitive electronics
- Stable from -40 °C to 200 °C without melting or curing
- Pre-cut 100 × 100 × 1.5 mm sheet fits common GPU and CPU coolers
UPSIREN OEM 21W/mK Thermal Pad
This UPSIREN OEM thermal pad measures 100x100x1.5mm and weighs 23g. It provides a thermal conductivity of 21W/mK for CPU, GPU, laptop heatsink or LED cooler applications. The silicone pad is non-conductive and non-corrosive. It suits builders who need a single reusable interface sheet.
Installation and common issues
The pad has a hardness of 30 degrees, making it soft and compressible for easy assembly. Natural viscosity allows it to fit closely to the chip surface and be reused. It is non-curing and non-toxic, so it will not dry out or damage components. Users who need a pre-applied paste or a thinner gap filler should look elsewhere.
Sustained load behaviour
Rated for long-term operation from -40 to 200°C, the pad will not melt under continuous high temperatures. It maintains insulation, anti-static and fire-retardant properties during extended use. The material resists wear, compression set and corrosion over time. Buyers requiring a liquid metal compound for extreme overclocking cannot use this pad.
商品特色
- 21 W/mK conductivity moves heat fast from chip to heatsink
- Soft 30 Shore pad compresses to fill uneven gaps for full contact
- Non-conductive silicone prevents shorts while insulating sensitive electronics
- Stable from -40 °C to 200 °C without melting or curing
- Pre-cut 100 × 100 × 1.5 mm sheet fits common GPU and CPU coolers
商品規格
| Brand | UPSIREN |
|---|---|
| Series | OEM |
| Model | 21W |
| Volume / Net Weight | 23g |
| Thermal Conductivity | 21W/mk |
| Long Term Operating Temperature | -40 to 200 C |
| Features | Non-Corrosive, Non-Curing & Non-Toxi |
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商品問答
How can I confirm the pad is performing correctly after installation?
Monitor component temperatures under load; the pad is rated for 21 W/mK conductivity and stable operation from -40 to 200 °C.
What does the package contain and is anything else required?
One 100 × 100 × 1.5 mm silicone pad weighing 23 g; no extra materials are needed for installation.
Which thickness should I choose for my application?
This model is 1.5 mm thick with 30-degree Shore hardness, suited for gaps matching that dimension.
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