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Square grey silicone thermal pad 100 by 100 by 1.5 mm

UPSIREN

UPSIREN OEM 21W/mK Thermal Pad 100x100x1.5mm 23g

SKU CH-Z1J3-8BYJH

A 100 × 100 × 1.5 mm silicone thermal pad rated at 21 W/mK conductivity, non-conductive and reusable from −40 °C to 200 °C

  • Volume / Net Weight23g
  • Thermal Conductivity21W/mk
  • Long Term Operating Temperature-40 to 200 C
  • FeaturesNon-Corrosive, Non-Curing & Non-Toxi

Option 100 x 100 x 1.5 mm

  • 21 W/mK conductivity moves heat fast from chip to heatsink
  • Soft 30 Shore pad compresses to fill uneven gaps for full contact
  • Non-conductive silicone prevents shorts while insulating sensitive electronics
  • Stable from -40 °C to 200 °C without melting or curing
  • Pre-cut 100 × 100 × 1.5 mm sheet fits common GPU and CPU coolers

UPSIREN OEM 21W/mK Thermal Pad

This UPSIREN OEM thermal pad measures 100x100x1.5mm and weighs 23g. It provides a thermal conductivity of 21W/mK for CPU, GPU, laptop heatsink or LED cooler applications. The silicone pad is non-conductive and non-corrosive. It suits builders who need a single reusable interface sheet.

Installation and common issues

The pad has a hardness of 30 degrees, making it soft and compressible for easy assembly. Natural viscosity allows it to fit closely to the chip surface and be reused. It is non-curing and non-toxic, so it will not dry out or damage components. Users who need a pre-applied paste or a thinner gap filler should look elsewhere.

Sustained load behaviour

Rated for long-term operation from -40 to 200°C, the pad will not melt under continuous high temperatures. It maintains insulation, anti-static and fire-retardant properties during extended use. The material resists wear, compression set and corrosion over time. Buyers requiring a liquid metal compound for extreme overclocking cannot use this pad.

Najważniejsze cechy

  • 21 W/mK conductivity moves heat fast from chip to heatsink
  • Soft 30 Shore pad compresses to fill uneven gaps for full contact
  • Non-conductive silicone prevents shorts while insulating sensitive electronics
  • Stable from -40 °C to 200 °C without melting or curing
  • Pre-cut 100 × 100 × 1.5 mm sheet fits common GPU and CPU coolers

Specyfikacja

BrandUPSIREN
SeriesOEM
Model21W
Volume / Net Weight23g
Thermal Conductivity21W/mk
Long Term Operating Temperature-40 to 200 C
FeaturesNon-Corrosive, Non-Curing & Non-Toxi

Inne wersje tego modelu

Jeszcze 5 w tej samej serii

Ta sama rodzina, inna pamięć, inne chłodzenie lub taktowanie — proszę porównać przed decyzją.

Pytania dotyczące tego produktu

How can I confirm the pad is performing correctly after installation?

Monitor component temperatures under load; the pad is rated for 21 W/mK conductivity and stable operation from -40 to 200 °C.

What does the package contain and is anything else required?

One 100 × 100 × 1.5 mm silicone pad weighing 23 g; no extra materials are needed for installation.

Which thickness should I choose for my application?

This model is 1.5 mm thick with 30-degree Shore hardness, suited for gaps matching that dimension.

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