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Square grey silicone thermal pad 100 by 100 by 2.0 mm

UPSIREN

UPSIREN OEM 18W 100x100x2.0mm thermal pad

SKU CH-34XX-VBNN2

A 100 × 100 × 2.0 mm silicone thermal pad rated at 18 W/mK conductivity for CPU, GPU and LED heatsink gaps

  • Volume / Net Weight23g
  • Thermal Conductivity18W/mk
  • Long Term Operating Temperature-40 to 200 C
  • FeaturesNon-Corrosive, Non-Curing & Non-Toxi

Option 100 x 100 x 2.0 mm

  • High thermal conductivity of 18 W/mK for efficient heat transfer
  • Non-conductive silicone ensures electrical safety on sensitive components
  • Soft 30-degree hardness allows tight conformity to uneven surfaces
  • Wide operating range from -40 °C to 200 °C without melting
  • Reusable pad with natural viscosity simplifies installation and maintenance

18 W/mK thermal pad for chips and heatsinks

The UPSIREN OEM thermal pad measures 100 by 100 millimetres with a 2.0 millimetre thickness and 23 gram mass. It delivers 18 W/mK thermal conductivity and operates from minus 40 to 200 degrees Celsius. The silicone material is non-conductive, non-corrosive, non-curing and non-toxic.

Soft 30-degree pad fits gaps without curing

A 30-degree shore hardness lets the pad compress easily and conform to uneven surfaces between a chip and its heatsink. Natural tack holds it in place during assembly yet allows repositioning or reuse. Electrical insulation prevents shorts on exposed PCB components.

Replaces grease where a solid gap-filler is needed

The pad suits builds that need a reusable, mess-free interface instead of thermal paste. It bridges larger tolerances on laptop GPUs, CPU heatspreaders, LED modules or power electronics. Buyers who require a thinner or higher-conductivity sheet should look elsewhere.

Najważniejsze cechy

  • High thermal conductivity of 18 W/mK for efficient heat transfer
  • Non-conductive silicone ensures electrical safety on sensitive components
  • Soft 30-degree hardness allows tight conformity to uneven surfaces
  • Wide operating range from -40 °C to 200 °C without melting
  • Reusable pad with natural viscosity simplifies installation and maintenance

Specyfikacja

BrandUPSIREN
SeriesOEM
Model18W
Volume / Net Weight23g
Thermal Conductivity18W/mk
Long Term Operating Temperature-40 to 200 C
FeaturesNon-Corrosive, Non-Curing & Non-Toxi

Inne wersje tego modelu

Jeszcze 5 w tej samej serii

Ta sama rodzina, inna pamięć, inne chłodzenie lub taktowanie — proszę porównać przed decyzją.

Pytania dotyczące tego produktu

What does the 18 W/mK thermal conductivity mean for real-world heat transfer?

The pad is rated at 18 W/mK, so it moves heat from a GPU, CPU or LED module to the heatsink far more effectively than standard 1–6 W/mK pads, reducing throttling under sustained load.

Will a 100 × 100 × 2.0 mm sheet cover my laptop GPU die and VRAM in one piece?

The pad measures 100 mm by 100 mm and is 2.0 mm thick; you can cut it to the exact die and VRAM outlines, and the 30 Shore 00 softness lets it conform without excessive pressure.

How do I install it without trapping air bubbles that hurt conductivity?

Clean both surfaces with isopropyl alcohol, peel the protective film, lay the pad flat starting from one edge, then press evenly so the natural viscosity spreads it and pushes air out — do not stretch or tear the 23 g sheet.

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