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DELL

DELL PowerEdge R650xs 1U rack server 2x Xeon Gold 5317 3.0GHz 12C 64GB DDR4 H745 10x 1.8TB SAS

SKU CH-81F0-MQ4S1

1U rack server with dual Xeon Gold 5317 processors, 64GB DDR4, PERC H745 RAID, and ten 1.8TB SAS drives

  • TypeRack
  • Rack Height1U
  • Redundant Hot-swap PowerYes
  • AI FeaturesNone
  • CPU TypeIntel Xeon
  • CPU Speed16
  • Dual Xeon Gold 5317 CPUs deliver 12 cores each at 3.0 GHz base
  • 64 GB DDR4 ECC memory runs at 2933 MHz for fast data access
  • PERC H745 RAID controller with 4 GB NV cache supports RAID 0/1/5/6/10/50/60
  • Ten 1.8 TB 10K SAS drives provide high-capacity 2.5" storage
  • iDRAC9 Enterprise enables remote management with quad-port 1 GbE networking

Dual Xeon Gold 5317 compute

This 1U rack server ships with two Intel Xeon Gold 5317 processors at 3.0 GHz base and 3.6 GHz turbo, each with 12 cores. The 64 GB of DDR4 2933 MHz registered ECC memory is installed as four 16 GB modules. It targets virtualization, cloud infrastructure and dense data analytics workloads that need high core counts in a compact footprint.

Redundant 1400 W platinum power

Two hot-swap 1400 watt platinum-efficiency power supplies provide full redundancy and handle peak loads from the CPUs, ten 1.8 TB 10K SAS drives and the PERC H745 controller with 4 GB NV cache. The 1U chassis uses Dell 15G thermal design to move air front-to-back through the dense drive bay and processor area. iDRAC 9 Enterprise monitors temperatures and fan speeds remotely.

Ten-bay 2.5" front storage

The front panel holds ten 2.5 inch SAS bays populated with 1.8 TB enterprise drives connected to the PERC H745 supporting RAID 0/1/5/6/10/50/60. An OCP 3.0 slot carries a Broadcom 5720 quad-port 1 GbE network card for four copper links. Ready Rails and a front bezel are included for standard rack mounting. The system supports up to 1 TB total DDR4 memory across 16 DIMM slots and optional GPU acceleration for AI tasks.

Points forts

  • Dual Xeon Gold 5317 CPUs deliver 12 cores each at 3.0 GHz base
  • 64 GB DDR4 ECC memory runs at 2933 MHz for fast data access
  • PERC H745 RAID controller with 4 GB NV cache supports RAID 0/1/5/6/10/50/60
  • Ten 1.8 TB 10K SAS drives provide high-capacity 2.5" storage
  • iDRAC9 Enterprise enables remote management with quad-port 1 GbE networking

Caractéristiques

BrandDELL
SeriesPowerEdge R650xs
ModelR650xs
Part Number3.00 GHz
TypeRack
Rack Height1U
Redundant Hot-swap PowerYes
AI FeaturesNone
CPU TypeIntel Xeon
CPU Speed16
CPU SocketLGA 4189
Number of CPU Cores12-Core Processor
# of Processors InstalledGold 5317
MAX Processors2
Chipset0
Installed Memory Size64GB
Memory TypeDDR4
Max Memory Capacity1TB
Storage ControllerDell Perc H745 Controller
HDD InterfaceSAS
Raid LevelRAID 0/1/5/6/10/50/60
Media Drives0
GPU TypeMatrox G200
Video Memory8MB
Ethernet ControllerDell EMC 15G Broadcom 5720 Quad Port 1GbE OCP 3.0 Network Card
LAN Ports4 x Ports
Expansion Slots0
Management PortRJ 45
Operating SystemNo
Features10 x 2.5" SATA/SAS Hot-Plug Drive Bays

Questions sur cet article

How are the 10x 2.5" SAS drives and the H745 RAID controller installed in this 1U server, and which step is commonly missed?

The 10x 1.8TB SAS drives slide into the front 2.5" hot-swap bays; the H745 controller installs in the dedicated front RAID slot. The step often missed is connecting the controller's NV cache battery and enabling the 4GB cache in the RAID BIOS before creating virtual disks.

What maintenance will the H745 RAID controller's 4GB NV cache battery require over time?

The H745 controller's 4GB NV cache includes a battery that degrades with charge cycles; it will need replacement when the iDRAC9 Enterprise or controller BIOS reports a battery health warning, typically after several years of continuous operation.

Which thermal or power limit appears first when both Xeon Gold 5317 CPUs run sustained workloads at 3.6GHz turbo?

With two 1400W Platinum PSUs and 1U airflow, the platform power budget and VRM thermal ceiling are reached before the CPUs can sustain 3.6GHz all-core turbo indefinitely; clocks will throttle to stay within the 1U thermal envelope.

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