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Square grey thermal pad 30mm by 30mm 1.5mm thick

Thermal Grizzly

Thermal Grizzly Minus Pad 8 30x30x1.5mm thermal pad

SKU CH-CVK9-RQKSA

A 30 mm square thermal pad, 1.5 mm thick, with a ceramic-silicon and nano-aluminium-oxide formula for high conductivity and easy installation on CPUs, GPUs or memory

  • Single 30mm x 30mm pad covers key components
  • 5mm thickness fits tight clearances
  • Ceramic silicon and nano aluminium oxide formula enables ultra-high conductivity
  • Highly elastic surface conforms with light pressure
  • Engineered in Germany and RoHS compliant

Thermal Grizzly Minus Pad 8 30×30×1.5 mm

A single high-performance thermal pad measuring 30 mm by 30 mm with a 1.5 mm thickness. It uses a ceramic-silicon formula with nano aluminium oxide to deliver ultra-high thermal conductivity. The highly elastic, flexible material conforms instantly with the lightest touch for optimal heat transfer between component and cooler.

Suited for precise GPU, CPU or memory module gaps

Ideal for builders who need a 1.5 mm thick pad cut to 30 mm square for a specific component gap. Not suited for applications requiring a different thickness, larger surface area, multiple pads in one pack, or liquid metal thermal interface material instead of a solid pad.

1.5 mm thickness decides fit

The 1.5 mm dimension is the critical specification that determines whether this pad matches the stack height of your cooler and component. Verify the exact gap before purchase; a thicker or thinner pad will not provide proper contact pressure or thermal performance.

Points forts

  • Single 30mm x 30mm pad covers key components
  • 5mm thickness fits tight clearances
  • Ceramic silicon and nano aluminium oxide formula enables ultra-high conductivity
  • Highly elastic surface conforms with light pressure
  • Engineered in Germany and RoHS compliant

Caractéristiques

Aucune caractéristique publiée pour cet article pour l’instant.

Questions sur cet article

How much heat can the 8 W/m·K rating move in a real build?

The 8 W/m·K conductivity gives a steady heat path between a chip and its cooler, limited by the 1.5 mm thickness and the pressure applied.

Is the pad electrically conductive or capacitive?

The ceramic silicon and nano-aluminium-oxide formula is non-conductive, so it will not short adjacent pads or traces.

Will a single 30 mm square cover my VRM or memory module?

One 30 × 30 mm pad fits most individual VRM MOSFETs or memory ICs; larger areas need multiple pads.

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