저희는 암호화폐로 결제를 받습니다 — 보유하신 코인으로 실제 하드웨어를 구매하실 수 있습니다.암호화폐로 결제하고, 실제 하드웨어 구매에 사용하십시오. 전 세계 어디서나 US$399 이상 구매 시 무료 보험 배송. 무지 상자에 담아 독일에서 발송합니다.US$399 이상 구매 시 무료 보험 배송. 체크아웃을 시작하면 30분 동안 환율이 잠깁니다.30분간 환율 잠금. 모든 제품은 밀봉된 상태로 일련번호를 확인한 후 24개월 보증을 제공합니다.밀봉 포장, 24개월 보증.

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Thermal Grizzly

Thermal Grizzly Minus Pad 8 30x30x1.5mm thermal pad

SKU CH-CVK9-RQKSA

A 30 mm square thermal pad, 1.5 mm thick, with a ceramic-silicon and nano-aluminium-oxide formula for high conductivity and easy installation on CPUs, GPUs or memory

  • Single 30mm x 30mm pad covers key components
  • 5mm thickness fits tight clearances
  • Ceramic silicon and nano aluminium oxide formula enables ultra-high conductivity
  • Highly elastic surface conforms with light pressure
  • Engineered in Germany and RoHS compliant

Thermal Grizzly Minus Pad 8 30×30×1.5 mm

A single high-performance thermal pad measuring 30 mm by 30 mm with a 1.5 mm thickness. It uses a ceramic-silicon formula with nano aluminium oxide to deliver ultra-high thermal conductivity. The highly elastic, flexible material conforms instantly with the lightest touch for optimal heat transfer between component and cooler.

Suited for precise GPU, CPU or memory module gaps

Ideal for builders who need a 1.5 mm thick pad cut to 30 mm square for a specific component gap. Not suited for applications requiring a different thickness, larger surface area, multiple pads in one pack, or liquid metal thermal interface material instead of a solid pad.

1.5 mm thickness decides fit

The 1.5 mm dimension is the critical specification that determines whether this pad matches the stack height of your cooler and component. Verify the exact gap before purchase; a thicker or thinner pad will not provide proper contact pressure or thermal performance.

주요 특징

  • Single 30mm x 30mm pad covers key components
  • 5mm thickness fits tight clearances
  • Ceramic silicon and nano aluminium oxide formula enables ultra-high conductivity
  • Highly elastic surface conforms with light pressure
  • Engineered in Germany and RoHS compliant

사양

이 상품에 대해 아직 공개된 사양이 없습니다.

이 상품에 대한 질문

How much heat can the 8 W/m·K rating move in a real build?

The 8 W/m·K conductivity gives a steady heat path between a chip and its cooler, limited by the 1.5 mm thickness and the pressure applied.

Is the pad electrically conductive or capacitive?

The ceramic silicon and nano-aluminium-oxide formula is non-conductive, so it will not short adjacent pads or traces.

Will a single 30 mm square cover my VRM or memory module?

One 30 × 30 mm pad fits most individual VRM MOSFETs or memory ICs; larger areas need multiple pads.

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고객들이 함께 비교한 상품

같은 진열대, 같은 체크아웃 — 코인 8종, 환율 잠금 30분.