Thermalright MC-2 ARGB Memory Cooler White 3200 RPM
- Fan & Heatsinks
- DDR/DDR2/DDR3/DDR4/…
Prihvaćamo kriptovalute — tako kriptovalute koje posjedujete mogu kupiti pravi hardver.Plaćajte kriptovalutom, trošite je na pravi hardver. Besplatna osigurana dostava diljem svijeta iznad 399 $. Obični vanjski kartoni bez oznaka, otpremaju se iz Njemačke.Besplatna osigurana dostava iznad 399 $. Vaš je tečaj blokiran 30 minuta od otvaranja blagajne.Tečaj blokiran 30 minuta. Svaki je artikl zapečaćen, njegov serijski broj provjeren, i pokriven jamstvom od 24 mjeseca.Zapečaćen, jamstvo 24 mjeseca.
HPE
Cools a processor in HPE servers using a 7 lb passive heatsink assembly
This HPE 508996-001 heatsink assembly is engineered for processor cooling in Hewlett Packard Enterprise systems. It serves technicians and IT departments maintaining or repairing compatible server or workstation hardware. The unit provides the necessary thermal interface for the designated processor socket.
The assembly operates without an integrated fan, relying on system airflow directed across its fins to dissipate heat. This design eliminates fan noise and reduces moving-part failure points within the chassis. Power draw is effectively zero as the unit contains no electrical components.
The package contains the heatsink assembly itself without mounting brackets, thermal compound, or retention hardware. Installers must source compatible retention mechanisms and thermal interface material separately for their specific platform. This suits environments where spare mounting kits are already stocked.
| Brand | HP |
|---|---|
| Color | Multi-color |
| Type | Heatsinks only |
| Fan Size | n/a |
| Weight | 7LBS |
Mount the assembly onto the processor socket using the designated retention mechanism, then secure it firmly; the step often missed is verifying full contact between the heatsink base and the processor heat spreader before locking it down.
Periodically clean dust from the fin stack to maintain airflow, and replace the thermal interface material between the heatsink and processor whenever the assembly is removed or reseated.
The heatsink's ability to dissipate heat without active airflow becomes the limiting factor; if case airflow is insufficient, processor temperatures will rise until thermal throttling engages.
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