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Rectangular grey silicone thermal pad 85 by 45 by .5 mm

Lirealar

Lirealar Thermal Pad 12.8 W/mK 85x45x3mm

SKU CH-TG8Y-HWEMM

High-conductivity 12.8 W/mK silicone pad sized 85×45×0.5 mm for CPU, GPU or laptop heatsinks, electrically insulating and reusable

  • Thermal Conductivity12.8 W/mK

Size 85x45x3.0mm

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  • High 12.8 W/mK conductivity moves heat fast from GPU and CPU
  • Non-conductive silicone keeps shorts away from sensitive components
  • 85 × 45 × .5 mm sheet fits laptop heatsinks and LED coolers
  • Non-corrosive, non-curing material stays effective through repeated disassembly
  • Natural tack lets you position and reuse the pad without extra adhesive

Thermal Pad 12.8 W/mK

This thermal pad measures 85 by 45 by 0.5 mm and provides a thermal conductivity of 12.8 W/mK. It is designed for laptop heatsinks, GPU, CPU and LED cooler applications. The material is non-conductive, non-corrosive, non-curing and non-toxic.

Thermals and Power

The pad transfers heat efficiently between component and cooler without conducting electricity. Its insulated construction prevents short circuits while the natural viscosity keeps it in place during normal use. No curing time is required and the pad remains reusable after disassembly.

Upgrade Path

Builders replacing dried or lower-conductivity pads on compact boards will benefit from the higher 12.8 W/mK rating. The thin 0.5 mm profile suits tight gaps where thicker pads cannot fit. Users needing thicker interfaces or larger surface coverage should select a different size.

特長

  • High 12.8 W/mK conductivity moves heat fast from GPU and CPU
  • Non-conductive silicone keeps shorts away from sensitive components
  • 85 × 45 × .5 mm sheet fits laptop heatsinks and LED coolers
  • Non-corrosive, non-curing material stays effective through repeated disassembly
  • Natural tack lets you position and reuse the pad without extra adhesive

仕様

Thermal Conductivity12.8 W/mK

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この商品に関する質問

How do I install the 85x45x0.5mm pad and what step is often missed?

Clean both surfaces, peel the protective film, place the pad without stretching it, then apply even pressure when mounting the heatsink; the step most people skip is removing both liner layers before assembly.

Will the 12.8 W/mK pad need replacement and how can I tell?

The silicone material is non-curing and non-corrosive, so it does not dry out; replace it only if the pad tears, loses its natural viscosity, or no longer makes full contact after disassembly.

What limit appears first when the pad runs under sustained load?

The 12.8 W/mK conductivity rating sets the thermal bottleneck; if the component generates more heat than the pad can transfer across its 0.5 mm thickness, temperatures will rise despite the heatsink.

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