EN-Labs 11-001-366 PCIe x4 USB 3.2 10Gbps 5-port card
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ASUS
An ATX motherboard for Intel 12th and 13th Gen processors with DDR5 memory up to 7200 MT/s, PCIe 5.0 graphics slot, three PCIe 4.0 M.2 sockets, 2.5 Gb Ethernet and rear USB 3.2 Gen 2x2 Type-C
The ASUS Prime B760-PLUS is an ATX board built around the Intel B760 chipset for 12th and 13th Gen Intel Core processors. It provides four DDR5 slots supporting up to 256 GB of memory and a PCIe 5.0 x16 slot for current graphics cards.
This board suits users who want three PCIe 4.0 M.2 slots, Realtek 2.5 Gb Ethernet and rear USB 3.2 Gen 2x2 Type-C. Builders requiring Wi-Fi, Thunderbolt 4 certification or more than four SATA ports should look elsewhere.
The single PCIe 5.0 x16 slot is the specification that decides compatibility with next-generation graphics cards. If your build relies on a PCIe 4.0 only platform, this slot still operates at the card's rated speed.
| Brand | ASUS |
|---|---|
| Series | Prime |
| Model | PRIME B760-PLUS |
| Part Number | 90MB1EF0-M0AAY0 |
| CPU Socket Type | LGA 1700 |
| CPU Type | Intel® Socket LGA1700 for 13th Gen Intel® Core™ & 12th Gen Intel® Core™, Pentium® Gold and Celeron® Processors* Supports Intel® Turbo Boost Technology 2.0 and Intel® Turbo Boost Max Technology 3.0** * Refer to www.asus.com for CPU support list. ** Intel® Turbo Boost Max Technology 3.0 support depends on the CPU types. |
| Chipset | Intel B760 |
| Number of Memory Slots | 4x288pin (DDR5) |
| Memory Standard | DDR5 7200+(OC)/7000(OC)/6800(OC)/6600(OC)/6400(OC)/6200(OC)/6000(OC)/5800(OC)/5600/5400/5200/5000/4800 Non-ECC, Un-buffered Memory* |
| Maximum Memory Supported | 256GB |
| Channel Supported | Dual Channel |
| PCI Express 5.0 x16 | 1 x PCIe 5.0 x16 slot |
| PCI Express 4.0 x16 | 1 x PCIe 4.0 x16 slot (supports x4 mode) |
| PCI Express 3.0 x16 | 2 x PCIe 3.0 x1 slots |
| Serial ATA (SATA) | 4 x SATA 6Gb/s |
| M.2 | Total supports 3 x M.2 slots and 4 x SATA 6Gb/s ports* Intel® 13th & 12th Gen Processors M.2_1 slot (Key M), type 2242/2260/2280 (supports PCIe 4.0 x4 mode) Intel® B760 Chipset M.2_2 slot (Key M), type 2242/2260/2280/22110 (supports PCIe 4.0 x4 mode) M.2_3 slot (Key M), type 2242/2260/2280 (supports PCIe 4.0 x2 mode) |
| SATA RAID | * Intel® Rapid Storage Technology supports SATA RAID 0/1/5/10. |
| Audio Channels | Realtek 7.1 Surround Sound High Definition Audio CODEC* - Supports: Jack-detection, Multi-streaming, Front Panel Jack-retasking - Supports up to 24-Bit/192 kHz playback Audio Features - Audio Shielding - Premium audio capacitors - Dedicated audio PCB layers * A chassis with an HD audio module in the front panel is required to support 7.1 Surround Sound audio output. |
| Max LAN Speed | 1 x Realtek 2.5Gb Ethernet |
| Back I/O Ports | 1 x USB 3.2 Gen 2x2 port (1 x USB Type-C®) 2 x USB 3.2 Gen 2 ports (2 x Type-A) 1 x USB 3.2 Gen 1 port (1 x Type-A) 2 x USB 2.0 ports (2 x Type-A) 1 x DisplayPort 1 x VGA port 1 x HDMI™ port 1 x Vertical M.2 slot (Key E) 1 x Realtek 2.5Gb Ethernet port 3 x Audio jacks |
| Other Connectors | Fan and Cooling related 1 x 4-pin CPU Fan header 1 x 4-pin AIO Pump header 3 x 4-pin Chassis Fan headers Power related 1 x 24-pin Main Power connector 1 x 8-pin +12V Power connector Storage related 3 x M.2 slots (Key M) 4 x SATA 6Gb/s ports USB 1 x USB 3.2 Gen 1 connector (supports USB Type-C® ) 1 x USB 3.2 Gen 1 header supports 2 additional USB 3.2 Gen 1 ports 2 x USB 2.0 headers support 4 additional USB 2.0 ports Miscellaneous 3 x Addressable Gen 2 headers 1 x Aura RGB header 1 x Clear CMOS header 1 x COM Port header 1 x Front Panel Audio header (AAFP) 1 x S/PDIF Out header 1 x SPI |
| Windows 11 | Windows® 11, Windows® 10 64-bit |
| Form Factor | ATX |
| Dimensions (W x L) | 12 inch x 9.6 inch ( 30.5 cm x 24.4 cm ) |
| Features | ASUS 5X PROTECTION III - DIGI+ VRM - LANGuard - Overvoltage Protection - SafeSlot Core+ - Stainless-Steel Back I/O ASUS Q-Design - Q-DIMM - Q-LED Core - Q-Slot ASUS Thermal Solution - M.2 heatsink - VRM heatsink design ASUS EZ DIY - ProCool Aura Sync - Aura RGB header - Addressable Gen 2 headers |
Lift the retention lever, align the processor triangle with the socket marker, lower the CPU gently without pressure, close the frame and lock the lever; the common error is forcing the chip before the notches engage.
The VRM heatsinks, M.2 heatsink, PCH heatsink and all case fans attached to the hybrid headers should be dusted regularly; the CPU cooler mounted on the socket also requires fresh thermal paste every few years.
The VRM and M.2 heatsinks rely on passive cooling, so thermal throttling of the power delivery or the PCIe 4.0 M.2_1 slot typically occurs before any electrical limit is reached.
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