LORDWORLD
LORDWORLD ESP32-S3 1.3inch 240×240 262K LCD Development Board
Compact ESP32-S3 board with 1.3 inch 240×240 262K LCD, 6-axis IMU, battery manager and 90° hardware rotation
- Compact 1.3 inch display fits tight enclosures
- 240×240 pixel 262K colour LCD shows sharp graphics
- Dual-core 240 MHz processor handles real-time tasks
- Built-in 6-axis IMU adds motion sensing
- ST7789V2 driver enables 90° hardware rotation
Compact IoT Development Board
The LORDWORLD ESP32-S3 board integrates a 1.3inch 262K colour LCD with a 240MHz dual-core processor. Onboard Wi-Fi and Bluetooth connectivity plus a 6-axis IMU suit rapid prototyping of wearable or sensor-driven IoT edge devices.
Low-Power Operation
The compact design draws minimal current during typical sensor and display tasks. Lithium battery recharge management is built in, allowing extended untethered operation without external power circuitry.
Embedded Integration Ready
SPI communication and 90° hardware rotation simplify mounting in tight enclosures. The ST7789V2 driver handles the 240×240 panel directly, freeing the developer from display timing concerns while leaving GPIO available for additional peripherals.
주요 특징
- Compact 1.3 inch display fits tight enclosures
- 240×240 pixel 262K colour LCD shows sharp graphics
- Dual-core 240 MHz processor handles real-time tasks
- Built-in 6-axis IMU adds motion sensing
- ST7789V2 driver enables 90° hardware rotation
사양
| Brand | LORDWORLD |
|---|
이 상품에 대한 질문
How do I install the board and which step is often missed?
Connect via USB-C for power and programming, then install the ESP32 board package in Arduino IDE; the step often missed is selecting the correct COM port and ESP32-S3 Dev Module before uploading.
What maintenance or replacement will the board need later?
The onboard lithium battery recharge manager handles the Li-ion cell; over time the battery itself may need replacement if capacity drops below usable levels.
What limit appears first during sustained use?
The 240 MHz dual-core processor can throttle due to heat in the compact 1.3 inch form factor during continuous high-load operation.
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